Patch Antenna EBG via Array for Directivity Stability
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Solution Overview
Problem
Patch antennas experience unwanted radiation from substrate end portions due to surface current propagation, which affects directivity, and existing electromagnetic band gap (EBG) structures are sensitive to variations in via diameter, leading to fluctuations in operating frequency and directivity disturbances.
Innovation Solution
A patch antenna device with a dielectric substrate and conductive structures featuring a patch-shaped conductor pattern and multiple connection conductors that connect to a ground plane, reducing surface current propagation to substrate end portions and minimizing directivity disturbances even with variations in connection conductor dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single connection conductor is used in the EBG structure, then the device complexity is reduced, but the operating frequency fluctuates due to via diameter tolerance
Solution Approach 1:
Multiple connection conductors (via holes) are combined within a single EBG structure to form a composite grounding system. This merging approach distributes the electromagnetic coupling function across multiple conductors, reducing the impact of individual via diameter variations on the overall operating frequency stability.
Solution Approach 2:
The design transitions from a single connection conductor to multiple connection conductors, changing the structural parameter of the EBG. This parameter change compensates for manufacturing tolerances in via diameter, as the collective effect of multiple conductors maintains more stable electromagnetic band gap characteristics and operating frequency.
2Manufacturing precision
If the via diameter tolerance is reduced, then the operating frequency stability is improved, but the manufacturing cost and difficulty increase
Solution Approach 1:
Instead of reducing via diameter tolerance, the design changes the parameter of the EBG structure by incorporating multiple connection conductors. This parameter change makes the system less sensitive to individual via diameter variations, allowing standard manufacturing tolerances to be used while maintaining frequency stability.
Solution Approach 2:
The design accepts the presence of via diameter variations within standard tolerances and converts this potential harm into a benefit by using multiple connection conductors. The distributed configuration ensures that variations in individual conductors average out, transforming manufacturing tolerance issues into a robust design feature.
3Manufacturing precision
If multiple connection conductors are used in the EBG structure, then the operating frequency stability is improved, but the device complexity increases
Solution Approach 1:
Multiple connection conductors are merged into a unified EBG structure where they function collectively as a single electromagnetic band gap element. This merging approach achieves frequency stability without requiring complex individual conductor designs, as the group acts as an integrated unit.
Solution Approach 2:
The multiple connection conductors serve multiple functions simultaneously: they provide electromagnetic coupling, form the EBG structure, and collectively compensate for manufacturing tolerances. This multi-functionality reduces the need for additional separate components, balancing complexity with performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces unwanted radiation and maintains directivity stability by minimizing frequency fluctuations, ensuring consistent performance despite tolerance variations in the connection conductor dimensions.
Implementation Method 1
The structure configured of the conductive patch and the conducting via has a band gap (an electromagnetic band gap) that prevents the propagation of the surface current from flowing through the ground plane at a specified frequency
Implementation Method 2
a plurality of connection conductors formed across the conductor pattern and the ground plane to penetrate the dielectric substrate for electrically connecting the conductor pattern to the ground plane
Data Source
AI summary
An antenna device includes: a dielectric substrate formed with a ground plane; a patch antenna having a dominant polarization direction in a predetermined direction on the dielectric substrate; at least one patch radiating element for supplying electric power provided on the patch antenna, the at least one patch radiating element being formed on the dielectric substrate; a patch-shaped conductor pattern formed on a substrate front face of the dielectric substrate on which the patch radiating element is formed; a plurality of connection conductors formed to penetrate the dielectric substrate for electrically connecting the conductor pattern to the ground plane; and a conductive structure having the conductor pattern and a plurality of the connection conductors. A plurality of the conductive structures is provided.