Patch on Interposer Wireless Interconnect for High Data Rate

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Solution Overview

Problem

In multi-CPU systems, direct communication between CPUs is limited by the number of socket connections and data rate, which can be enhanced by wireless interconnects but are costly and complex to implement due to the need for precise assembly of fine pitch transceiver chips on expensive package substrates.

Innovation Solution

The integration of a wireless interconnect on a Patch on Interposer (PoINT) architecture using a multilayer organic substrate with ultra-thin build-up layers, allowing for fine pitch assembly of millimeter wave transceiver dies on lower-cost interposers with coarser design rules, and attaching patches near the package edge to support radio dies with integrated antennas, reducing assembly complexity and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If wireless interconnects are implemented using fine pitch transceiver chips on expensive package substrates, then data rate and communication performance are improved, but manufacturing cost and assembly complexity increase significantly

Engineering Contradiction:

Improvedata rateVSAvoidmanufacturing cost

Core Design Contradiction:

SpeedVSEase of manufacture

Solution Approach 1:

The patent replaces expensive, precision-critical transceiver chips with lower-cost, coarser pitch radio dies that can be assembled using less precise processes. The radio dies are mounted on patches that are subsequently attached to the interposer, creating a hierarchical assembly that reduces overall manufacturing cost while maintaining wireless communication functionality.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The wireless interconnect function is segmented into separate components: radio dies, patches, and interposers. This segmentation allows each component to be optimized independently - radio dies can be manufactured with coarser pitch, patches provide mechanical support and signal routing, and interposers enable integration with the CPU package. This modular approach reduces assembly complexity and manufacturing cost.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If fine pitch transceiver chips are assembled on expensive package substrates, then wireless communication capability is achieved, but assembly complexity and device complexity increase

Engineering Contradiction:

Improvewireless communication capabilityVSAvoidassembly complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Patches serve as intermediary substrates between the radio dies and the final package assembly. The patches provide a stable mounting platform for radio dies and include signal routing traces that connect to the interposer. This intermediary layer simplifies the overall assembly process by decoupling the radio die attachment from the final package integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from direct chip-to-chip wireless integration to a multi-layer hierarchical structure (radio dies on patches on interposers on CPU packages). This dimensional expansion allows wireless functionality to be added without directly complicating the core CPU package assembly process.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If patches are attached to interposer away from the package edge, then signal routing is simplified, but interference from heat sinks increases

Engineering Contradiction:

Improvesignal routingVSAvoidheat sink interference

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent applies different placement strategies to different functional components: patches carrying radio dies are positioned near the package edge to minimize heat sink interference, while other components can be placed elsewhere. This localized optimization allows each component to be positioned for its specific performance requirements.

Inventive Principle:

Principle #3Local quality

4Adaptability or versatility

If socket connections are used for CPU communication, then system compatibility is maintained, but data rate and communication performance are limited

Engineering Contradiction:

Improvesystem compatibilityVSAvoiddata rate

Core Design Contradiction:

Adaptability or versatilityVSSpeed

Solution Approach 1:

The patent replaces mechanical socket connections with wireless electromagnetic communication for CPU-to-CPU data transfer. The radio dies transmit data wirelessly through the air interface, eliminating the physical constraints of socket pin counts and contact resistance, thereby achieving higher data rates while maintaining system compatibility through the interposer interface.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11737154B2Patch on interposer package with wireless communication interface

Publication Date: 2023.08.22 INTEL CORP

AI summary

A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.