Patch Package Structure with Molded Spacer for Adhesive Protection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional patch package structures are inefficient in preventing the pressure-sensitive adhesive layer from adhering to the inner surfaces of the package, especially when the adhesive layer is thick or contains a large liquid component, leading to difficulties in removing the patch and potential impermeability issues due to laminate failures.

Innovation Solution

A patch package structure comprising a planar first sheet material and a molded second sheet material with a protrudent part and recessed part, where the minimum gap distance between the sheet materials is greater than the patch thickness, and the outer surface of the second sheet material rises at an obtuse angle, preventing the adhesive layer from contacting the inner surfaces and allowing easy removal of the patch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a thick pressure-sensitive adhesive layer is used to hold a large amount of drug, then the drug loading capacity is improved, but the adhesive layer protrudes from the patch edge and adheres to the package inner surfaces

Engineering Contradiction:
Improvedrug loading capacityVSAvoidease of patch removal
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

A release liner is introduced as an intermediary between the pressure-sensitive adhesive layer and the package inner surface. The release liner prevents direct contact and adhesion between the adhesive and package surfaces, allowing the adhesive to protrude without causing removal difficulties. This mediator solves the contradiction by enabling both thick adhesive layers for drug loading and easy patch removal.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-generated harmful factors

If a blister pack in container form is used to prevent adhesive contact, then the adhesive leakage prevention is improved, but the package becomes thick and increases overall volume

Engineering Contradiction:
Improveadhesive leakage preventionVSAvoidpackage volume
Core Design Contradiction:
Object-generated harmful factorsVSVolume of stationary object

Solution Approach 1:

The protective function is extracted from a three-dimensional blister pack structure and implemented instead by a two-dimensional release liner. This extraction reduces the package volume while maintaining the adhesive prevention function. The release liner provides the necessary protection without adding significant thickness to the package.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

A thin film release liner is used instead of a rigid or semi-rigid blister pack structure. This thin film approach provides adequate adhesive prevention while minimizing package thickness and volume, directly addressing the contradiction between protection and compactness.

Inventive Principle:
Principle #30Flexible shells and thin films

3Object-generated harmful factors

If a release liner larger than the patch is used to prevent adhesive contact, then the adhesive prevention is improved, but the package becomes thick and handling cost increases

Engineering Contradiction:
Improveadhesive contact preventionVSAvoidpackage structure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The release liner is sized to extend beyond the patch edges, providing excessive coverage that ensures complete prevention of adhesive contact with the package. This partial extension beyond what is strictly necessary at each point provides robust protection while maintaining simplicity in the overall package structure.

Inventive Principle:
Principle #16Partial or excessive action

4Volume of stationary object

If the package structure is made thin and compact, then the handling cost and transportation efficiency are improved, but the adhesive layer may contact the package inner surfaces

Engineering Contradiction:
Improvepackage compactnessVSAvoidadhesive adhesion to package
Core Design Contradiction:
Volume of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The release liner serves as a mediator that enables package compactness while preventing adhesive adhesion. By placing this intermediary layer between the adhesive and package surfaces, the design achieves both thin/compact package structure and effective adhesive prevention simultaneously.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9433533B2Patch package structure
Publication Date: 2016.09.06 NITTO DENKO CORP
  • US9433533B2 patent drawing
  • US9433533B2 patent drawing
  • US9433533B2 patent drawing

AI summary

The present invention provides a patch package structure, which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, the first and second sheet materials being sealed together in peripheral parts thereof, and a patch disposed in the package, in which the patch contains a backing, a pressure-sensitive adhesive layer laminated on at least one side of the backing, and a release liner which protects a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer; the second sheet material has been molded so as to have a protrudent part in at least a substantially central area thereof, the protrudent part having a planar outer shape larger than a planar outer shape of the release liner and having at least one recessed part; d is not smaller than T, in which d is the minimum gap distance between the inner surface of the first sheet material and the inner surface of the second sheet material at the recessed part and T is a thickness of the patch; and, at the boundary between the sealed part where the first and second sheet materials are sealed together and an unsealed part, the outer surface of the second sheet material rises at an obtuse angle.