High-Density Patch Panel Bezel With Integrated Grounding
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Solution Overview
Problem
Existing patch panel systems lack efficient methods for cable termination and management, which can lead to disorganization and inefficiencies in telecommunications equipment interconnection.
Innovation Solution
A telecommunications patch panel system featuring multiport bezel assemblies with a metal bonding strip and a two-row array of jack receptacle openings, secured within a panel frame, that includes grounding contact elements and latching mechanisms for secure jack module insertion and cable management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cable termination methods are used in patch panels, then installation is simpler, but cable management and organization become inefficient
Solution Approach 1:
The bezel assembly is divided into multiple compartments, each designed to hold specific cable types or connection types. This segmentation allows for organized cable management while maintaining efficient termination processes, as each compartment can be independently managed and accessed.
Solution Approach 2:
The patent introduces a vertical dimension to cable management by stacking multiple bezel assemblies within the panel frame. This multi-level arrangement optimizes space utilization and improves cable organization by separating different cable runs vertically, thereby enhancing both termination efficiency and manageability.
2Adaptability or versatility
If more jack receptacle openings are added to increase connectivity, then interconnection capacity improves, but structural complexity increases
Solution Approach 1:
The bezel assembly design incorporates multiple jack receptacle openings that can accommodate various connector types within a standardized structure. This universal design allows the same bezel assembly to serve multiple functions and support different cable types, thereby increasing interconnection capacity without proportionally increasing structural complexity.
3Reliability
If grounding contact elements are added to ensure electrical safety, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The grounding contact elements are integrated into the bezel assembly structure itself, merging the grounding function with the mechanical support structure. This combination eliminates the need for separate grounding components, thereby ensuring electrical safety while simplifying the manufacturing process and reducing assembly steps.
Data Source
AI summary
A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).