Path Change Circuit Bypasses Bonding Resistance in Display Devices
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Solution Overview
Problem
Display devices face line defects due to increased bonding resistance between bumps and pads on the substrate, caused by foreign substances, uneven distribution of conductive balls, or environmental factors like temperature and humidity, leading to improper signal delivery and image display issues.
Innovation Solution
A display device configuration that includes a path change circuit and buffer pad set in the non-display area, allowing signal delivery through buffer pads when enable signals are input, effectively bypassing increased bonding resistance issues between data driver bumps and substrate pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the data driver is directly connected to the substrate pads through bumps and anisotropic conductive film, then the signal delivery path is simple and device complexity is low, but bonding resistance increases due to foreign substances, uneven conductive ball distribution, or environmental factors, causing line defects
Solution Approach 1:
The patent introduces buffer pads as intermediary connection points between the data driver bumps and the substrate pads. These buffer pads act as mediators that can receive signals from multiple bumps and redistribute them, preventing direct dependency on single bump-substrate pad connections that are prone to bonding resistance issues. The buffer pads serve as a protective layer that isolates the signal path from the harmful effects of foreign substances and uneven conductive ball distribution.
Solution Approach 2:
The patent segments the signal delivery path into multiple independent routes by introducing buffer pads that can receive signals from different bumps. This segmentation allows the system to divide the original single-point connection into multiple connection points, so that if one bump-substrate pad connection fails due to bonding resistance, other segments can still maintain signal delivery through alternative paths.
2Adaptability or versatility
If multiple output pad sets are provided with path change capability, then adaptability and fault tolerance are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements dynamic signal path routing capability where the system can switch between different signal delivery paths based on operational needs or detected faults. The buffer pads are configured to dynamically select and activate alternative connection paths when bonding resistance is detected in primary paths, providing adaptability without requiring complex manual reconfiguration or repair processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents line defects by ensuring reliable signal delivery even with increased bonding resistance, eliminating the need for panel repair during manufacturing or usage, and maintaining image quality without wasting or repairing defective display panels.
Implementation Method 1
Conductive balls, which are conductive particles, are scattered in large numbers at the anisotropic conductive film such that an electric signal is delivered between the bump of the source drive IC and the pad on the substrate
Implementation Method 2
The bump of the source drive IC and the pad on the substrate adhere to each other through an anisotropic conductive film (ACF)
Data Source
AI summary
A display device includes a display panel including a display area and a non-display area, a first output pad set, a second output pad set, and a buffer pad set that are disposed in the non-display area, and a path change circuit. In an exemplary embodiment, the path change circuit is configured to change a signal delivery path such that a signal delivered through the first output pad set or the second output pad set is delivered through the buffer pad set, when an enable signal is input.