Pattern-Forming Composition Using Dual Molecular Weight Polymers

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Solution Overview

Problem

Conventional pattern-forming methods face challenges in achieving uniform dimension reduction and directional uniformity, particularly for base patterns with anisotropic shapes like elliptic or circular shapes, leading to difficulties in obtaining desired substrate patterns with minimal Critical Dimension Uniformity (CDU).

Innovation Solution

A pattern-forming method involving the application of a composition containing polymers that interact with the base pattern, followed by heating and selective removal of non-interacted polymer portions, allowing for etching to form a resist pattern with superior directional uniformity, using a combination of polymers with different weight average molecular weights and functional groups for enhanced interaction and etching resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a side wall film is formed on a side wall of each opening in a base pattern to shrink the opening diameter, then the pattern dimension is reduced, but the directional uniformity of dimension reduction is poor especially for anisotropic shapes

Engineering Contradiction:
Improvedimension reduction uniformityVSAvoiddirectional uniformity
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent applies parameter changes by using polymers with different weight average molecular weights (Mw) in the composition. Specifically, it combines a first polymer with Mw of 5,000-25,000 and a second polymer with Mw of 25,000-50,000. This parameter variation in molecular weight enables different polymers to interact differently with the base pattern surfaces, achieving uniform dimension reduction in both longitudinal and lateral directions while maintaining directional uniformity for anisotropic shapes.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If conventional side wall film formation is used, then pattern shrinking is achieved, but Critical Dimension Uniformity (CDU) is poor

Engineering Contradiction:
Improvepattern dimension controlVSAvoidCDU
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent employs composite materials by formulating a composition that contains multiple polymers with different weight average molecular weights. The composition includes a first polymer (Mw: 5,000-25,000) and a second polymer (Mw: 25,000-50,000), creating a composite system that provides both uniform pattern shrinking and excellent Critical Dimension Uniformity (CDU). The synergistic interaction of different polymer molecules enhances the reliability and precision of pattern dimension control.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If a single polymer composition is used for side wall film formation, then the process is simple, but uniform interaction with base pattern surfaces is difficult to achieve

Engineering Contradiction:
Improveprocess simplicityVSAvoidinteraction uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies local quality by using polymers with different weight average molecular weights that interact differently with various surfaces of the base pattern. The first polymer (lower Mw) and second polymer (higher Mw) provide localized interaction characteristics that ensure uniform coating and interaction across different regions of the base pattern, including both longitudinal and lateral surfaces, thereby achieving precise and uniform dimension reduction.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves superior directional uniformity in dimension reduction, enabling the formation of substrate patterns with desired shapes and reduced CDU, suitable for advanced microfabrication processes in semiconductor devices and other applications.

Implementation Method 1

heating the composition (I) after the applying (hereinafter, may be also referred to as 'heating step')

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

the composition comprising one or a plurality of polymers (hereinafter, may be also referred to as '(A) polymer' or 'polymer (A)') that is/are capable of interacting with a first polymer (hereinafter, may be also referred to as '(P) polymer' or 'polymer (P)') constituting the base pattern

Methodology Applied
Scientific EffectPolymer interaction: Chemical Bonding

Implementation Method 3

removing a portion of the polymer(s) (A) not having interacted with the polymer (P) (hereinafter, may be also referred to as 'removing step')

Methodology Applied
Scientific EffectSelective removal:

Data Source

PatentUS10394121B2Pattern-forming method and composition
Publication Date: 2019.08.27 JSR CORPORATION
  • US10394121B2 patent drawing
  • US10394121B2 patent drawing
  • US10394121B2 patent drawing

AI summary

A composition includes two types of polymers each having a different weight average molecular weight. The two types of polymers are each a styrene polymer having a group which bonds to at least one end of a main chain and which includes at least one of a hydroxy group, a carboxy group, a sulfanyl group, an epoxy group, a cyano group, a vinyl group or a carbonyl group. A difference in weight average molecular weight between the two types of polymers is no less than 2,000 and no greater than 30,000.