Pattern Forming Method for Semiconductor Microfabrication
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Solution Overview
Problem
Current microfabrication techniques for semiconductor devices, such as MEMS, face challenges in achieving higher throughput due to the prespread phenomenon, where resist droplets spread on the substrate before mold contact, prolonging the time required for resist spreading between the substrate and mold, especially when dealing with multiple areas.
Innovation Solution
A pattern forming method that involves discretely dropping a curable composition on multiple shot areas, waiting for a specific time, and then bringing the composition into contact with a mold, ensuring equal times for both dropping and imprinting, and adjusting the waiting time based on the number of shot areas in each group to maintain uniformity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the layering step is sequentially performed on multiple areas to allow resist prespreading, then the resist spreading time in the mold contacting step is shortened, but the total processing time increases due to sequential operations
Solution Approach 1:
The substrate is divided into multiple shot area groups with different numbers of shot areas. This segmentation allows parallel processing of multiple areas while managing the prespreading phenomenon systematically, improving throughput without sacrificing pattern formation quality
Solution Approach 2:
The waiting step is introduced as a preliminary action before the mold contacting step. This waiting period allows the resist to prespread uniformly across all shot areas before molding begins, ensuring consistent pattern formation while enabling parallel processing to improve throughput
2Productivity
If the number of shot areas varies between shot area groups, then parallel processing efficiency is improved, but process complexity increases
Solution Approach 1:
The number of shot areas in each shot area group is varied as a controlled parameter. By intentionally creating different group sizes (e.g., 6 areas in one group, 4 areas in another), the process optimizes parallel processing efficiency while the waiting time parameter compensates for the complexity introduced by varying group sizes
3Manufacturing precision
If the waiting time is adjusted based on the number of shot areas, then uniform pattern quality is maintained across all areas, but the process control becomes more complex
Solution Approach 1:
The waiting time is determined based on feedback from the number of shot areas in each group. This feedback mechanism ensures that each group receives appropriate prespreading time regardless of its size, maintaining uniform pattern quality across all areas while systematically managing the complexity through a clear calculation rule
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the time required for resist spreading and imprinting, enhancing the throughput of microfabrication processes by ensuring consistent and uniform processing across all shot areas, thereby improving the efficiency of pattern formation.
Implementation Method 1
irradiating the curable composition (A1) with light from a side of the mold to cure the curable composition (A1)
Data Source
AI summary
Pattern forming method includes, for each shot area group (SAG) in the following order: discretely dropping curable composition droplets to layer the droplets on a plurality of shot areas included in a certain SAG on substrate; waiting for a time of (mmax−m)×Td, where Td is a time for the dropping on one shot area, m is the number of shot areas included in the certain SAG, and mmax is the maximum value of m; and imprinting in order that the dropping is performed on the plurality of shot areas. The time Td and a time Ti for the imprinting on one shot area are equal to each other. The number of shot areas included in at least one SAG is different from the number of shot areas included in another at least one SAG. In the waiting, the dropping and the imprinting are not performed.