Pattern Forming Method for Optical Nanoimprint
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In optical nanoimprint technology, achieving high adhesion between photocurable compositions and substrates while maintaining separability from the mold is challenging, leading to pattern peeling defects and prolonged filling times due to high contact angles on carbon-based layers like SOC.
Innovation Solution
A pattern forming method involving a two-step dispensing process with a curable composition (A1) substantially free of fluorosurfactant and a second composition (A2) with a low fluorosurfactant concentration, applied on a carbon-based underlayer with a high carbon content, to reduce contact angles and enhance filling rates, eliminating the need for adhesion layers and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If a photocurable composition is applied on a carbon-based underlayer (SOC) to form a pattern, then the filling process is prolonged due to high contact angles, but using conventional adhesion layers adds process complexity
Solution Approach 1:
The invention changes the chemical composition parameters of the photocurable composition by incorporating specific surfactants (fluorosurfactant at 0.01-5 wt% and/or silicon-containing surfactant at 0.01-5 wt%) to modify surface tension and contact angle characteristics, thereby reducing filling time without adding adhesion layer processes
Solution Approach 2:
The surfactants act as intermediary substances that mediate between the photocurable composition and the carbon-based underlayer, reducing interfacial tension and contact angle to accelerate wetting and filling while maintaining adhesion, eliminating the need for separate adhesion layers
2Reliability
If adhesion layers are formed between photocurable composition and substrate, then adhesion is improved, but manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The invention merges the adhesion promotion function and the photocurable composition function into a single integrated formulation by incorporating surfactants directly into the photocurable composition, eliminating the need for separate adhesion layers and reducing process steps
Solution Approach 2:
The invention extracts the adhesion-promoting functionality from the separate adhesion layer and integrates it into the photocurable composition itself through surfactant additives, simplifying the overall process structure
3Loss of time
If fluorosurfactant is added to reduce contact angle and accelerate filling, then filling time is reduced, but adhesion to carbon-based layers deteriorates
Solution Approach 1:
The invention creates a composite surfactant system combining fluorosurfactant and silicon-containing surfactant in specific concentrations, where the fluorosurfactant reduces contact angle for fast filling while the silicon-containing surfactant maintains adhesion to carbon-based underlayers, achieving both goals simultaneously
Solution Approach 2:
The invention optimizes the concentration parameters of different surfactants (fluorosurfactant at 0.01-5 wt% and silicon-containing surfactant at 0.01-5 wt%) to balance the competing effects of contact angle reduction and adhesion maintenance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures strong adhesion to carbon-based layers without adhesion layers, reduces pattern peeling, and accelerates the filling process, increasing manufacturing yield and etching process margins while maintaining high mechanical strength of the cured film.
Implementation Method 1
a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely
Implementation Method 2
droplets of the resist spread throughout the gap between the substrate and the mold by capillary action. This phenomenon is called spreading
Implementation Method 3
the resist is cured by being irradiated with light (a light irradiation step)
Data Source
AI summary
A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.