Pattern Inspection Alignment for Accurate Semiconductor Corner Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods struggle to accurately identify and measure corner points and inter-corner distances in miniaturized semiconductor circuit patterns due to variations from design data, particularly in corner points with chamfered shapes.
Innovation Solution
A pattern inspection and measurement apparatus that specifies corner pairs on design data and correlates them with actual shape patterns using additional information and alignment techniques to accurately determine corner points and distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If corner points are identified using traditional methods on miniaturized patterns, then processing can be performed, but measurement precision deteriorates due to chamfered shapes and deviations from design data
Solution Approach 1:
The patent performs preliminary alignment between the captured image and design data before corner point identification. By establishing a coordinate transformation relationship in advance, the system prepares the measurement framework to accommodate expected deviations, enabling accurate corner point specification even when manufacturing variations occur.
Solution Approach 2:
The system uses the captured image information to feedback-correct the corner point identification process. By comparing the actual captured pattern with the design data and using the alignment results to adjust the measurement coordinates, the system compensates for manufacturing deviations and achieves accurate corner point specification.
2Ease of operation
If traditional corner point identification methods are used, then simple processing is maintained, but device complexity increases when handling miniaturized patterns with chamfered corners
Solution Approach 1:
The patent introduces an intermediary coordinate transformation system that bridges the design data coordinate system and the captured image coordinate system. This intermediary layer, represented by the alignment information and transformation relationships, enables corner point identification without requiring direct complex analysis of the chamfered shapes, simplifying the overall processing logic.
3Measurement precision
If detailed corner point analysis is performed on miniaturized patterns, then measurement precision improves, but processing time increases
Solution Approach 1:
By performing alignment and establishing coordinate transformation relationships in advance, the system prepares all necessary measurement frameworks before actual corner point identification. This preliminary preparation eliminates the need for time-consuming real-time calculations during corner point specification, enabling fast and accurate inter-corner distance measurement.
Data Source
AI summary
An object of the disclosure is to provide a pattern inspection and measurement apparatus that can accurately specify a corner point formed on a sample. The pattern inspection and measurement apparatus according to the disclosure specifies a pair of corner points as a corner pair candidate on design data, and specifies a corner point on an actually formed shape pattern in accordance with a relative relation between the corner pair candidate on the design data and the corner pair candidate in the shape pattern (see FIG. 13).