Pattern Measuring Device Reference Data Generation
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Solution Overview
Problem
Current methods for inspecting semiconductor circuit patterns are inadequate in accurately measuring shape deformation due to discrepancies between manufacturing conditions and the use of suboptimal reference patterns, leading to costly re-manufacturing and simulation errors.
Innovation Solution
A pattern measuring device and semiconductor measuring system that generates reference pattern data from image or contour line data of circuit patterns created under various manufacturing conditions, allowing for accurate comparison and measurement of shape deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a reference pattern is created under assumed optimal manufacturing conditions, then inspection can be performed, but measurement accuracy deteriorates due to discrepancies between assumed and actual conditions
Solution Approach 1:
The patent applies preliminary action by measuring multiple circuit patterns at different manufacturing conditions before inspection, and pre-processing this data to generate an integrated reference pattern that compensates for condition variations. This preliminary measurement and integration process eliminates the need to assume optimal conditions, thereby resolving the contradiction between ease of reference pattern creation and measurement accuracy.
2Device complexity
If simulation-based reference patterns are used, then inspection setup is simplified, but measurement accuracy deteriorates due to simulation errors
Solution Approach 1:
The patent applies copying by creating a reference pattern that is copied from actual measured circuit patterns rather than from simulation data. By measuring real circuit patterns under various conditions and integrating them, the system creates an empirical reference that accurately reflects actual manufacturing variations, eliminating simulation errors while maintaining inspection setup simplicity.
3Ease of manufacture
If design patterns are used as reference, then reference pattern creation is straightforward, but measurement accuracy deteriorates due to shape differences from actual patterns
Solution Approach 1:
The patent applies parameter changes by transforming the reference pattern creation process from using fixed design parameters to using dynamically measured parameters from actual circuit patterns. By changing the source of reference data from theoretical design to empirical measurement across multiple conditions, the system maintains ease of reference creation while achieving high measurement accuracy through statistical integration.
4Measurement precision
If multiple patterns are measured and integrated, then measurement accuracy improves, but processing time and complexity increase
Solution Approach 1:
The patent applies preliminary action by performing measurements under multiple conditions and integrating them in advance, before the actual inspection process. This pre-computation of an integrated reference pattern eliminates the need for repeated complex processing during inspection, thereby reducing processing time while maintaining high measurement accuracy through comprehensive data integration.
Data Source
AI summary
An object of the invention is to provide a pattern measuring device for generating appropriate reference pattern data while suppressing an increase in the manufacturing cost that would occur when manufacturing conditions are finely changed. A pattern measuring device has an arithmetic processing unit for measuring a pattern formed on a sample. The arithmetic processing unit, on the basis of signals obtained with a charged particle beam device, acquires or generates image data or contour line data on a plurality of circuit patterns created under different manufacturing conditions of a manufacturing apparatus, and generates reference data to be used for measurement of a circuit pattern from the image data or contour line data.