Pattern Portion Metric Determination Using Geometrical Block Masks
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Solution Overview
Problem
Current methods for determining characteristic metrics for patterns on substrates in semiconductor manufacturing are inefficient and prone to errors, particularly in multiple patterning technology processes where manual measurement of critical dimensions and edge placement errors is time-consuming and inaccurate.
Innovation Solution
A method is developed to automatically determine metrics for separate portions of a pattern on a substrate by receiving pattern information, blocking portions of the pattern using geometrical block masks, and measuring the unblocked portions using scanning electron microscope images, thereby facilitating accurate and efficient measurement of critical dimensions and edge placement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual measurement methods are used for critical dimensions and edge placement errors, then measurement accuracy can be maintained through human inspection, but measurement time and operational complexity increase significantly
Solution Approach 1:
The measurement system performs automatic self-measurement of pattern portions using scanning electron microscope images. The system independently identifies, blocks, and measures pattern portions without requiring manual intervention, thereby reducing measurement time while maintaining accuracy through automated algorithms
Solution Approach 2:
The patent replaces manual mechanical measurement operations with an automated computational system. The measurement apparatus uses software-based pattern recognition and automated image processing to substitute human operators, significantly reducing measurement time while maintaining or improving precision
2Loss of information
If the entire pattern is measured at once, then comprehensive data is obtained, but measurement complexity and time consumption increase
Solution Approach 1:
The measurement process divides the pattern into separate portions that are measured individually. The system blocks different portions sequentially and measures each portion separately, obtaining comprehensive data while simplifying the measurement process for each segment
Solution Approach 2:
The system performs preliminary blocking of pattern portions based on pattern information before measurement. This pre-processing step organizes the measurement sequence and prepares the measurement apparatus, reducing overall process complexity
3Productivity
If automated measurement is implemented, then measurement speed and productivity improve, but measurement precision may deteriorate due to lack of manual verification
Solution Approach 1:
The automated measurement system incorporates feedback mechanisms where measurement results are continuously refined. The system uses scanning electron microscope images to verify measurements and adjusts measurement parameters based on detected pattern characteristics, ensuring high precision while maintaining automated high-speed operation
Data Source
AI summary
Systems and methods for determining one or more characteristic metrics for a portion of a pattern on a substrate are described. Pattern information for the pattern on the substrate is received. The pattern on the substrate has first and second portions. The first portion of the pattern is blocked, for example with a geometrical block mask, based on the pattern information, such that the second portion of the pattern remains unblocked. The one or more metrics are determined for the unblocked second portion of the pattern. In some embodiments, the first and second portions of the pattern correspond to different exposures in a semiconductor lithography process. The semiconductor lithography process may be a multiple patterning technology process, for example, such as a double patterning process, a triple patterning process, or a spacer double patterning process.