Pattern Transfer Mold With Electrostatic Stacked Bodies
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Solution Overview
Problem
Current methods for forming fine patterns in electronic devices and micro electromechanical systems face challenges in achieving high resolution and throughput, with conventional photolithography nearing its limits and nanoimprint lithography struggling with probe wear and non-uniform contact states.
Innovation Solution
A pattern transfer mold with a base body, first and second stacked bodies, and electrodes, where the stacked bodies contain conductive layers and insulating layers, allowing for uniform contact and deformation to transfer fine patterns onto a patterning body through controlled voltage application, enabling high-resolution and high-throughput pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithography is used to form fine patterns, then manufacturing precision can be maintained at current levels, but productivity and resolution are limited due to approaching technology limits
Solution Approach 1:
The patent replaces the optical-based photolithography system with a mechanical imprinting system. A mold with fine patterns is pressed onto a resist-coated substrate to transfer the pattern directly, eliminating the need for complex optical alignment and exposure processes. This mechanical approach enables higher throughput while achieving finer pattern resolutions that are difficult to obtain with conventional photolithography.
Solution Approach 2:
The patent creates a physical copy of the desired pattern structure by fabricating a mold with the target pattern and using it to imprint the design onto the substrate. This copying approach allows for high-fidelity pattern transfer with excellent reproducibility, enabling both high resolution and high productivity simultaneously by reusing the same mold for multiple substrate processing cycles.
2Productivity
If nanoimprint lithography is used to improve resolution and throughput, then productivity and manufacturing precision are enhanced, but probe wear and non-uniform contact states occur
Solution Approach 1:
The patent transitions from single-point or single-line probe-based imprinting to a planar mold structure that contacts the substrate across a two-dimensional area simultaneously. This dimensional change ensures uniform contact across the entire pattern transfer region, eliminating the non-uniform contact states and probe wear issues associated with probe-based methods while maintaining high resolution and throughput.
3Productivity
If repeated probing is used to achieve high throughput, then productivity increases, but probe wear occurs reducing reliability
Solution Approach 1:
The patent extracts the pattern information from a fragile probe tip and transfers it to a robust planar mold structure. The mold serves as a durable template that can be reused repeatedly without wear, as the pattern is defined by the mold's rigid structure rather than by a protruding probe that is susceptible to damage. This extraction of the patterning function from the probe eliminates probe wear while maintaining high productivity through repeated use of the same mold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise and reproducible transfer of fine patterns with improved stability and throughput, overcoming the limitations of existing technologies by ensuring uniform contact and reducing probe wear, while maintaining high resolution.
Implementation Method 1
A pattern transfer mold with a base body, first and second stacked bodies, and electrodes, where the stacked bodies contain conductive layers and insulating layers, allowing for uniform contact and deformation to transfer fine patterns onto a patterning body through controlled voltage application
Data Source
AI summary
According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.