Patternable TBDB Adhesive for Selective 3D Assembly Bonding

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Solution Overview

Problem

Conventional temporary bond de-bond (TBDB) adhesives lack flexibility in curing methods, leading to issues such as cracking and adverse impact on components with incompatible dimensions during high volume manufacturing of 3D IC/optical assemblies, particularly due to the lack of selective curing and adverse contact with carrier surfaces.

Innovation Solution

Employing patternable TBDB adhesives with photocatalysts for UV-induced crosslinking, allowing for selective patterning and partial curing, which enables the assembly of components with different dimensions without damaging fragile structures by providing clearance and stability during assembly and subsequent processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional TBDB adhesives are used for bonding components in 3D IC/optical assemblies, then bonding can be achieved, but cracking occurs and components with incompatible dimensions are adversely impacted

Engineering Contradiction:

Improvebonding reliabilityVSAvoidcracking and component damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a patterned adhesive layer where only specific regions contain adhesive material while other regions are adhesive-free. This allows different areas of the carrier to have different properties: bonded regions provide structural support while adhesive-free regions prevent cracking propagation and accommodate dimensional mismatches between components.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The adhesive layer is segmented into discrete patterned regions rather than being continuous. This segmentation isolates stress concentrations to specific areas and prevents crack propagation across the entire bonded interface, thereby improving bonding reliability while reducing component damage.

Inventive Principle:

Principle #1Segmentation

2Strength

If full curing of TBDB adhesive is applied, then strong bonding is achieved, but fragile structures are damaged due to lack of selective curing

Engineering Contradiction:

Improvebond strengthVSAvoiddamage to fragile structures

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent implements local quality through spatially selective curing where UV light is applied only to specific patterned regions containing the adhesive. This creates locally cured adhesive zones with appropriate bond strength while leaving other regions uncured to protect fragile structures from thermal and mechanical stress during the bonding process.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies partial curing action by using UV light to cure only the necessary adhesive regions rather than curing the entire adhesive layer. This partial action provides sufficient bond strength for assembly while avoiding excessive curing that would damage temperature-sensitive or mechanically fragile components.

Inventive Principle:

Principle #16Partial or excessive action

3Area of stationary object

If blanket adhesive coating is used on carrier surface, then complete coverage is achieved, but components with over-hanging portions make adverse contact with carrier surface

Engineering Contradiction:

Improveadhesive coverage areaVSAvoidadverse contact with carrier surface

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a patterned adhesive distribution where adhesive is present only in specific regions required for bonding, while adhesive-free regions are strategically placed to prevent adverse contact between over-hanging component portions and the carrier surface.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent extracts the adhesive material from continuous blanket coverage and places it only where needed in patterned regions. This removal of adhesive from unnecessary areas eliminates the harmful effect of adverse contact between over-hanging components and the carrier surface while maintaining adequate adhesive coverage for bonding.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates the assembly of complex 3D IC/optical assemblies by preventing component damage and ensuring proper alignment and stability during manufacturing, enabling high volume production with improved yield and reduced defects.

Implementation Method 1

employing patternable TBDB adhesives with photocatalysts for UV-induced crosslinking

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

TBDB photopolymer adhesive with incorporated photocatalysts to allow for patterning of the TBDB adhesive layer

Methodology Applied

Scientific EffectPhotocatalysis: Catalysis

Data Source

PatentUS20250210398A1Patternable bond-debond processes and apparatuses

Publication Date: 2025.06.26 INTEL CORP

AI summary

In some embodiments, a patternable TBDB for assembling 3D assemblies such as IC/optical assemblies are provided. A patternable TBDB adhesive may be formed using silicone based TBDB adhesives with incorporated photocatalysts to allow for patterning of the TBDB adhesive layer.