3D Patternable Thermal Interface for Irregular Gap Conformability
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Solution Overview
Problem
Conventional thermal interface materials face challenges in achieving thin bond lines with sufficient conformability, robustness, and thermal conductivity, especially when dealing with irregular thermal surfaces, leading to reduced thermal performance.
Innovation Solution
A patternable thermal interface body is constructed using additive deposition to customize its geometry, employing curable resin precursors with varying viscosities, thermally conductive particles, and controlled curing to match the gap geometry between thermal surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional thermal interface materials are used to achieve thin bond lines, then the bond line thickness is reduced, but the conformability to irregular thermal surfaces deteriorates
Solution Approach 1:
The patent applies parameter changes by controlling the viscosity of the thermal interface material during application. The material is formulated with specific viscosity characteristics that enable it to flow and conform to irregular surfaces while maintaining the ability to achieve thin bond lines. This parameter optimization resolves the contradiction between thinness and conformability.
Solution Approach 2:
The patent implements local quality by allowing the thermal interface material to have varying properties at different locations. The material formulation enables regions of different viscosity and flow characteristics within the same bond line, permitting excellent conformability in irregular areas while maintaining thinness in flat regions.
2Length of moving object
If conventional thermal interface materials are used to achieve thin bond lines, then the bond line thickness is reduced, but the mechanical robustness deteriorates
Solution Approach 1:
The patent employs composite materials by formulating the thermal interface material as a composite composition containing thermally conductive particles dispersed in a polymer matrix. This composite structure provides both the thin bond line capability and the mechanical robustness required, as the particle-reinforced matrix maintains strength even at reduced thicknesses.
Solution Approach 2:
The patent applies parameter changes by optimizing the cured modulus and mechanical properties of the thermal interface material. Through controlled curing processes and material formulation, the patent achieves a balance where the material maintains sufficient mechanical strength and robustness while enabling thin bond line applications.
3Length of moving object
If conventional thermal interface materials are used to achieve thin bond lines, then the bond line thickness is reduced, but the thermal performance deteriorates due to surface contours
Solution Approach 1:
The patent applies parameter changes by optimizing the viscosity and flow characteristics of the thermal interface material. The material is formulated with specific rheological properties that enable it to penetrate and fill surface contours and irregularities while maintaining a thin overall bond line, thereby preserving thermal performance.
Solution Approach 2:
The patent implements local quality by enabling the thermal interface material to adapt its local thickness and density distribution. The material can concentrate in regions of surface irregularities and maintain uniform thinness in flat regions, ensuring optimal thermal contact across the entire interface while maintaining thin bond line overall.
4Adaptability or versatility
If silicone greases or waxes are used as thermal interface materials, then conformability is improved, but form-stability deteriorates at elevated temperatures
Solution Approach 1:
The patent employs composite materials by formulating a thermal interface material that combines the conformability of grease-like substances with the thermal stability of cured polymers. The composite composition maintains form-stability at elevated temperatures while retaining adequate conformability through controlled viscosity characteristics.
Solution Approach 2:
The patent applies phase transitions by utilizing a material that transitions from a flowable, conformable state during application to a stable, form-retaining state after curing. This phase change enables the material to exhibit grease-like conformability during installation while achieving the form-stability of a solid at operating temperatures.
5Stability of the object's composition
If thermal interface materials are packaged as film, sheet, tape, or pad, then form-stability is improved, but conformability deteriorates due to high bulk modulus
Solution Approach 1:
The patent applies parameter changes by controlling the bulk modulus and mechanical properties of the thermal interface material. The material is formulated with optimized elasticity and compliance parameters that enable it to conform to irregular surfaces while maintaining sufficient form-stability to hold its shape and position.
Solution Approach 2:
The patent implements dynamics by creating a thermal interface material with time-dependent and condition-dependent properties. The material exhibits flexible, conformable behavior during application and installation, then transitions to a more stable, form-retaining state during operation, adapting its mechanical properties to different operational phases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a thermal interface body with enhanced thermal conductivity and conformability to irregular surfaces, optimizing heat transfer performance by closely matching the gap geometry.
Implementation Method 1
the first curable resin precursor includes silicone and exhibits a first initial viscosity and a thermal conductivity of at least 0.2 W/m*K
Implementation Method 2
applying a first curable resin precursor onto a surface in a first pattern of a plurality of discrete volumes... applying at least one of the first curable resin precursor and a second material in a second pattern of discrete volumes
Data Source
AI summary
A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process, wherein sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.