Patterned Adhesive Tape Sheet for Semiconductor Edge Protection

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Solution Overview

Problem

Existing adhesive tapes used in semiconductor manufacturing lack flexibility and adaptability to handle varying densities and patterns of semiconductor structures, leading to inefficiencies and potential damage during processing.

Innovation Solution

An adhesive tape sheet with a non-patterned region and patterned regions defined by incision patterns, featuring open and extension portions, allowing for varying densities and orientations of pattern portions to match semiconductor structures, and a method of manufacturing semiconductor devices using these tapes to enhance handling and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If adhesive tape uses a uniform pattern density across the entire surface, then manufacturing is simple, but it cannot adapt to varying densities of semiconductor structures at different regions

Engineering Contradiction:

Improveadaptability to varying pattern densitiesVSAvoidcomplexity of pattern design

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The adhesive tape is designed with different pattern densities in different regions: a first pattern density in a first region and a second pattern density in a second region. This local differentiation allows the tape to adapt to varying semiconductor structure densities at different locations on the wafer, improving protection effectiveness without requiring a completely complex custom design for each application.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The adhesive tape surface is segmented into multiple regions with distinct pattern characteristics. The incision patterns are divided into different groups (first incision patterns and second incision patterns) with different densities, allowing each segment to serve specific functional requirements for different areas of the semiconductor wafer.

Inventive Principle:

Principle #1Segmentation

2Reliability

If adhesive tape has continuous pattern coverage, then protection is comprehensive, but it causes residual adhesive issues and contamination

Engineering Contradiction:

Improveprotection effectivenessVSAvoidresidual adhesive and contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

Incision patterns are created by removing adhesive material in specific patterns, extracting the adhesive from certain areas while maintaining it in others. This allows the tape to provide protection where needed while eliminating residual adhesive issues in other areas, directly addressing the contamination problem.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The adhesive tape incorporates a porous or interrupted structure through the incision patterns, creating a patterned adhesive layer with both adhesive regions and non-adhesive regions. This porous design enables comprehensive protection through the adhesive portions while the non-adhesive portions prevent residual adhesive contamination.

Inventive Principle:

Principle #31Porous materials

3Reliability

If adhesive tape uses high pattern density, then protection coverage is improved, but flexibility and handling become difficult

Engineering Contradiction:

Improveprotection coverageVSAvoidflexibility and handling

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

Different regions of the adhesive tape have different pattern densities optimized for their specific functions. Regions requiring high protection coverage have higher pattern density, while regions requiring flexibility have lower pattern density or larger open areas, allowing the tape to maintain both protection effectiveness and ease of handling.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive tape sheet provides enhanced protection and handling of semiconductor structures by adapting to different pattern densities and orientations, reducing damage and contamination, and enabling efficient processing without residual adhesives.

Implementation Method 1

the adhesive film includes an elastic polymer

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20260018451A1Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the same

Publication Date: 2026.01.15 SAMSUNG ELECTRONICS CO LTD

AI summary

An adhesive tape sheet includes an adhesive film including a first region attached to a semiconductor structure and vertically overlapping an edge of the semiconductor structure, and a second region adjacent to the first region. The adhesive film includes a non-patterned portion and a plurality of pattern portions defined by incision portions. A portion of the plurality of pattern portions include an open portion connected to the non-patterned portion in a first direction, and an extension portion having at least a portion extending from the open portion in a second direction opposite to the first direction and defined by the incision portions. A first group of the plurality of pattern portions are disposed on the first region and a second group of the plurality of pattern portions are disposed on the second region. A first density of the first group and a second density of the second group are different.