Patterned Auxetic Flexible Material for Non-Uniform Thermal Coupling

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Solution Overview

Problem

Traditional cooling systems for information handling systems face challenges such as difficulty in thermal coupling, large tube diameters, and decreased component density due to rigid components, especially in liquid cooling solutions for servers.

Innovation Solution

Employing a flexible material with localized structures having a negative Poisson's ratio, such as flexible graphite, that conforms to the shape of components, allowing for efficient thermal coupling and reduced space requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If rigid copper components are used for thermal coupling in liquid cooling systems, then thermal conductivity is improved, but adaptability to non-uniform surfaces deteriorates

Engineering Contradiction:
Improvethermal coupling efficiencyVSAvoidconformability to component surfaces
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent employs flexible graphite sheets instead of rigid copper components. The flexible graphite can conform to non-uniform surfaces of heat-generating components while maintaining effective thermal coupling. This resolves the contradiction by providing both thermal conductivity and surface adaptability through the flexible material's ability to bend and conform without compromising thermal performance.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state and mechanical properties of the thermal coupling material from rigid (copper) to flexible (graphite). This parameter change allows the material to simultaneously achieve good thermal conductivity and adaptability to various component surfaces, resolving the trade-off between thermal performance and conformability.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If large-diameter tubes are used for liquid flow in cooling systems, then cooling capacity is improved, but device density deteriorates

Engineering Contradiction:
Improvecooling capacityVSAvoidspace requirements
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent uses flexible graphite sheets as thin-film thermal management components that can be integrated directly onto component surfaces. This eliminates the need for large-diameter liquid cooling tubes, providing effective cooling while maintaining high device density and minimizing space requirements.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent extracts the liquid cooling tube infrastructure and replaces it with a direct-contact flexible graphite thermal coupling solution. This removes the bulky tube system while retaining cooling functionality, thereby improving device density without sacrificing cooling capacity.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If thick rigid components are used for thermal coupling, then thermal conductivity is improved, but ease of installation deteriorates

Engineering Contradiction:
Improvethermal coupling efficiencyVSAvoidinstallation time
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent employs thin flexible graphite sheets instead of thick rigid components. These flexible sheets can be easily installed by conforming them to the component surfaces, significantly reducing installation time while maintaining effective thermal coupling through their inherent flexibility and thermal conductivity.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the thickness and rigidity parameters of the thermal coupling material, transitioning from thick rigid components to thin flexible sheets. This parameter change enables rapid installation while preserving thermal performance, resolving the contradiction between thermal efficiency and installation ease.

Inventive Principle:
Principle #35Parameter changes

4Temperature

If liquid cooling systems are implemented in servers, then cooling effectiveness is improved, but device complexity increases

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces complex liquid cooling systems with simple flexible graphite thermal coupling sheets. These sheets can be directly applied to heat-generating components, providing effective cooling while dramatically reducing system complexity by eliminating pumps, tubes, and fluid management infrastructure.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent extracts and removes the complex liquid cooling infrastructure (pumps, large-diameter tubes, fluid pathways) and replaces it with a simple flexible graphite thermal coupling solution. This maintains cooling effectiveness while reducing device complexity to a minimal, easily implementable system.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal coupling and component density by conforming to non-uniform surfaces, reducing installation time, and maintaining effective cooling performance.

Implementation Method 1

at least one localized structure patterned within the flexible material, the at least one localized structure having a negative Poisson's ratio, such that when the member is mechanically coupled to a second structure using mechanical stress, the member conforms to features of the second structure

Methodology Applied
Scientific EffectNegative Poisson's ratio: Auxetic Structures

Implementation Method 2

heat-rejecting media mechanically and thermally coupled to the component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12449213B2Systems and methods for employing for forming and patterning flexible material
Publication Date: 2025.10.21 DELL PROD LP
  • US12449213B2 patent drawing
  • US12449213B2 patent drawing
  • US12449213B2 patent drawing

AI summary

A member may include a flexible material with thickness significantly smaller than that of other dimensions of the flexible material and at least one localized structure patterned within the flexible material, the at least one localized structure having a negative Poisson's ratio, such that when the member is mechanically coupled to a second structure using mechanical stress, the member conforms to features of the second structure.