Display Panel Chip Bonding With Patterned Bumps for Stable Coupling
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable coupling between the display panel and the driving chip, which can affect the stability and performance of the display device.
Innovation Solution
A display device design that includes a display panel with a base substrate and a driving chip connected via a bump, where an adhesive member is used to couple the first pad and chip pad, and the bump features patterns on both surfaces, enhancing electrical connectivity and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bump is used to electrically connect the first pad and chip pad, then electrical connectivity is improved, but coupling reliability between display panel and driving chip deteriorates
Solution Approach 1:
The patent merges the electrical connection function (bump) and mechanical coupling function (adhesive member) into a single integrated connection structure. The bump and adhesive member work together as a unified system to achieve both electrical connectivity and mechanical bonding between the display panel and driving chip, resolving the contradiction by combining multiple functions into one structure.
Solution Approach 2:
The adhesive member acts as an intermediary between the bump and the pads, providing additional mechanical support and bonding. This intermediary element enhances the overall coupling reliability without interfering with the electrical connection function of the bump, allowing both functions to coexist and reinforce each other.
2Reliability
If patterns are added to the bump surfaces, then coupling reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies patterns only to specific local regions of the bump surfaces (first and second surfaces) rather than the entire bump structure. These localized patterns provide enhanced coupling reliability at critical interfaces while minimizing the overall manufacturing complexity. The selective application of patterns allows for improved performance without requiring complex manufacturing processes for the entire bump.
3Strength
If adhesive member is used to couple pads, then mechanical bonding is improved, but electrical connection reliability may deteriorate
Solution Approach 1:
The patent segments the connection functions by dedicating the bump to electrical connection and the adhesive member to mechanical bonding. This functional segmentation allows each component to optimize its specific role without compromising the other. The bump maintains electrical connectivity while the adhesive member provides mechanical strength, and their combined action achieves both objectives simultaneously.
Data Source
AI summary
A display device includes a display panel including a base substrate and a first pad disposed on the base substrate. A driving chip includes a chip pad corresponding to the first pad and a bump electrically connecting the first pad and the chip pad to each other. An adhesive member is disposed between the display panel and the driving chip. The adhesive member couples the first pad and the chip pad to each other. The bump includes a first surface and a second surface opposite to the first surface in a thickness direction of the base substrate. The bump includes a plurality of patterns on the first surface and the second surface.