Patterned Carrier Wafer Recesses Align Semiconductor Devices

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Solution Overview

Problem

Automated placement and alignment of semiconductor devices during probe operations are challenging, particularly due to the lack of rigid support, which leads to movement and subsequent failure in automated pickup post-probe operation.

Innovation Solution

A patterned carrier wafer with recesses and sidewalls is used to align and secure semiconductor devices, employing a debondable adhesive to constrain lateral movement and ensure accurate positioning for testing and subsequent processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If semiconductor devices are placed on a flexible film for probe operations, then the devices can be handled in an automated process, but the devices lack rigid support and may move during probing, causing misalignment

Engineering Contradiction:

Improveautomated placement and handlingVSAvoidalignment precision

Core Design Contradiction:

Extent of automationVSManufacturing precision

Solution Approach 1:

The patent uses a flexible film as the base carrier for automated handling, but combines it with rigid support structures (recesses with sidewalls) to prevent device movement. The flexible film enables automated pickup and placement while the rigid recesses maintain alignment precision during probe operations.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The carrier combines a flexible film substrate with rigid support structures (recesses formed by etching or molding). This composite structure integrates the advantages of both flexible materials (for automation) and rigid materials (for precision alignment and movement constraint).

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If semiconductor devices are secured with strong adhesion for stable positioning, then alignment is maintained during probing, but the devices cannot be easily removed for subsequent processing

Engineering Contradiction:

Improvealignment stabilityVSAvoiddevice removal for reprocessing

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent uses a debondable adhesive whose bonding strength can be changed by applying specific conditions (such as heat, moisture, or chemical treatment). During probing, the adhesive maintains strong bonding for alignment stability; after probing, applying a trigger condition reduces the bonding strength to enable easy device removal for reprocessing.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive's bonding characteristics are made dynamic rather than static. The adhesive transitions from a strong-bonding state during probing to a weak-bonding state after probing, allowing the system to adapt to different operational requirements (stable positioning vs. easy removal).

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS10811298B2Patterned carrier wafers and methods of making and using the same

Publication Date: 2020.10.20 MICRON TECHNOLOGY INC

AI summary

An apparatus is provided, comprising: a wafer having a first planar surface and a second surface opposite the first surface. The second surface includes a plurality of recesses. Each recess includes a plurality of sidewalls and a lower surface and is configured to receive a semiconductor device. The plurality of sidewalls of each recess is configured to align the semiconductor device and constrain the semiconductor device from moving in a direction parallel to the second surface.