Patterned Catalyst Film for Fine Wiring Resolution
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Solution Overview
Problem
Conventional methods for manufacturing printed wiring boards using the full-additive method face limitations in resolution capability and reliability of fine wiring due to the use of thick plating resists and permanent resist materials between conductor circuits, which increase the complexity and cost of the process.
Innovation Solution
A method involving the formation of a patterned catalyst film on the surface of an insulating layer, followed by electroless plating to deposit a conductor metal and form a conductor circuit, reducing the number of processes and eliminating the need for plating resist layers and etching, while improving resolution and reliability through mask exposure or inkjet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thick plating resists are used in conventional full-additive method, then the conductor circuit can be formed, but the resolution capability and reliability of fine wiring deteriorate
Solution Approach 1:
The invention extracts and removes the plating resist layer from the conventional full-additive method, eliminating the need for mask exposure, development, and etching processes. By directly forming the catalyst pattern on the insulating layer and applying electroless plating, the patent achieves fine wiring with high resolution without the complexity of thick plating resists.
Solution Approach 2:
The invention performs preliminary action by pre-forming the catalyst pattern directly on the insulating layer before electroless plating. This preliminary catalyst layer serves as both the pattern definition and the nucleation site for metal deposition, eliminating the need for subsequent resist removal and etching steps.
2Ease of manufacture
If plating resist layers and etching steps are used, then conductor circuits can be formed, but the manufacturing process complexity and cost increase
Solution Approach 1:
The invention merges the pattern formation and metal deposition steps into a single integrated process. The catalyst pattern is formed directly on the insulating layer, and electroless plating is applied simultaneously, combining what were previously separate resist-based patterning and plating operations into one streamlined process that improves both ease of manufacture and fine wiring reliability.
Solution Approach 2:
The catalyst layer serves multiple functions: it defines the pattern, promotes electroless plating nucleation, and eliminates the need for separate resist and etching processes. This self-service approach where the catalyst layer performs multiple roles simplifies the manufacturing process while maintaining high precision.
3Productivity
If conventional full-additive method with plating resists is used, then conductor circuits are formed, but additional plating resist layers and etching steps are required
Solution Approach 1:
The invention extracts and eliminates the plating resist layers and etching steps from the conventional full-additive method. By using direct catalyst patterning followed by electroless plating, the patent reduces the number of manufacturing processes while simultaneously reducing device complexity by removing unnecessary intermediate layers and steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances the resolution and reliability of fine wiring by directly depositing conductor metals on patterned catalyst films, eliminating the need for additional plating resist layers and etching steps.
Implementation Method 1
a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film
Data Source
AI summary
A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.