Patterned Contact Layers with Conductive Adhesive for Optoelectronic Devices

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Solution Overview

Problem

Optoelectronic devices with electrically conductive adhesive layers experience delamination issues, leading to inadequate electrical contact between components, which affects their ageing stability.

Innovation Solution

The use of patterned contact layers with electrically conductive adhesives, where the contact layers are bonded together using an anisotropically conductive adhesive, enhancing adhesion and preventing delamination by creating noninterlocking or interlocking connections that cushion stress and ensure reliable electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an electrically conductive adhesive layer is used to bond the optoelectronic component and the second component, then electrical contact is established between the components, but delamination occurs after a certain time resulting in inadequate electrical contact

Engineering Contradiction:
Improveageing stability of electrical contactVSAvoidbonding stability between components
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The contact layers are patterned into multiple separate contact regions instead of continuous layers. This segmentation allows the adhesive layer to be distributed in discrete locations, reducing stress concentration and preventing delamination while maintaining electrical contact at each contact region.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contact layers have different properties in different regions - they are patterned to provide electrical contact where needed while leaving other regions for adhesive bonding. This local differentiation optimizes both electrical conductivity and bonding stability without compromising either function.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If contact layers are patterned to improve bonding stability, then delamination is prevented, but manufacturing complexity increases

Engineering Contradiction:
Improvebonding stabilityVSAvoidpatterned contact layer structure
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The contact layers are patterned during the manufacturing process before final assembly. This preliminary patterning allows for optimized bond formation and electrical contact establishment, preventing delamination issues that would require complex repairs or redesigns later.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves the ageing stability and mechanical stability of the electrical contact between optoelectronic components, reducing the likelihood of delamination and enhancing the device's performance by maintaining effective electrical connectivity.

Implementation Method 1

the first contact layer and the second contact layer are bonded together electrically conductively via an adhesive layer including an electrically conductive adhesive

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

creating noninterlocking or interlocking connections that cushion stress and ensure reliable electrical conductivity

Methodology Applied
Scientific EffectMechanical interlocking: Mechanical Fastener

Data Source

PatentUS8823184B2Optoelectronic device and method for the production thereof
Publication Date: 2014.09.02 DOLYA HOLDCO 5 LTD
  • US8823184B2 patent drawing
  • US8823184B2 patent drawing
  • US8823184B2 patent drawing

AI summary

An optoelectronic component includes a first substrate on which are arranged an active region and a first contact region, and a first contact layer arranged in the first contact region. The second component includes a second substrate on which is arranged at least one second contact layer arranged in a second contact region. The first contact layer connects electrically conductively with the active region and additionally is bonded to the second contact layer by an adhesive layer. The adhesive layer includes an electrically conductive adhesive. The first contact layer and/or the second contact layer are patterned at least in part.