Patterned Copper Antimicrobial Coating Without Electrical Conductivity
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Solution Overview
Problem
Existing antimicrobial technologies face challenges in providing effective, cost-efficient, and environmentally safe solutions for frequently touched surfaces, as they often involve copper nanoparticles and sputtering processes that are complex, costly, and generate waste, while chemical compositions can be harmful and lose effectiveness quickly.
Innovation Solution
A method involving a non-electrically conductive substrate with a catalytic ink pattern and electrolessly plated copper metal features, avoiding copper nanoparticles and sputtering, allowing for flexible application to various surfaces with high light transmittance and controlled antimicrobial efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles and sputtering processes are used to create antimicrobial surfaces, then antimicrobial efficacy is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent changes the manufacturing parameters from complex sputtering processes to simple electroless plating, and from copper nanoparticles to copper metal features. This parameter change maintains antimicrobial efficacy while dramatically simplifying manufacturing complexity and reducing costs.
Solution Approach 2:
The patent extracts the essential antimicrobial function from complex nanoparticle formulations and sputtering processes, isolating it to simple copper metal features applied through basic electroless plating. This extraction removes unnecessary manufacturing complexity while preserving the core antimicrobial capability.
2Reliability
If copper nanoparticles are used for antimicrobial surfaces, then antimicrobial properties are enhanced, but environmental safety and waste generation worsen
Solution Approach 1:
The patent replaces expensive, environmentally problematic copper nanoparticles with simpler, more environmentally benign copper metal features. The copper metal can be applied in controlled amounts through electroless plating, reducing waste generation while maintaining antimicrobial effectiveness.
Solution Approach 2:
The patent changes the material parameter from copper nanoparticles to copper metal, and the application method from complex nanoparticle deposition to simple electroless plating. This parameter change improves environmental safety by eliminating nanoparticle waste while preserving antimicrobial properties.
3Reliability
If chemical compositions are applied to surfaces for antimicrobial protection, then initial antimicrobial effect is achieved, but effectiveness is lost quickly over time
Solution Approach 1:
The patent replaces chemical compositions with physical copper metal features. The copper metal provides long-lasting antimicrobial protection through contact killing mechanisms rather than chemical degradation, significantly extending the duration of effectiveness from hours/days to months or years.
Solution Approach 2:
The copper metal features provide self-sustaining antimicrobial protection without requiring reapplication or activation. The copper continuously releases ions and provides contact killing, maintaining effectiveness over time without the degradation issues of chemical compositions.
4Reliability
If continuous copper metal coating is applied to surfaces, then antimicrobial coverage is maximized, but electrical conductivity issues arise
Solution Approach 1:
The patent segments the continuous copper metal coating into discrete, unconnected copper metal features. This segmentation maintains antimicrobial coverage through distributed copper contact points while eliminating electrical conductivity pathways between features, solving the conductivity issue.
Solution Approach 2:
The patent applies copper metal features only in specific localized areas rather than continuous coverage. Each local copper feature provides antimicrobial protection at its location while the gaps between features prevent electrical conductivity, achieving both antimicrobial effectiveness and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high antimicrobial efficacy against bacteria and viruses, with at least 90-99% kill rate within 120 minutes, while being safe, lightweight, and adaptable to diverse surfaces without electrical conductivity issues.
Implementation Method 1
electrolessly plating copper metal in registration with the at least one pattern of the catalytic ink
Implementation Method 2
disposing at least one pattern of a catalytic ink... electrolessly plating copper metal in registration with the at least one pattern of the catalytic ink
Data Source
AI summary
A non-electrically antimicrobial conductive article can be prepared by: A) providing a non-electrically conductive substrate with first and second opposing surfaces; B) disposing a pattern of a catalytic ink, having unconnected features, on the first opposing surface of the non-electrically conductive substrate, and drying, curing, or drying and curing the pattern of catalytic ink to form an intermediate article; C) electrolessly plating copper metal in registration with the pattern of catalytic ink, to provide a pattern of unconnected copper metal features in registration with the pattern of catalytic ink, to form the non-electrically conductive antimicrobial article, and D) optionally passivating the pattern having unconnected copper metal features. The prepared antimicrobial article can provide antimicrobial properties when applied to various surfaces that are frequently touched, to inhibit or reduce the transmission of various microorganisms from one person to another.