Patterned Copper Antimicrobial Surfaces Without Conductive Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antimicrobial technologies face challenges in providing effective, cost-efficient, and environmentally safe solutions for reducing the viability and transmission of infectious agents on frequently touched surfaces, while avoiding the use of copper nanoparticles and complex manufacturing processes like sputtering and sintering.
Innovation Solution
The development of antimicrobial articles with a non-electrically conductive substrate featuring a catalytic ink pattern and electrolessly plated copper metal pattern, applied using flexographic printing and electroless plating, which are designed to inhibit the growth and transmission of infectious agents without electrical conductivity issues and environmental waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles or sputtering/sintering processes are used, then antimicrobial efficacy is improved, but manufacturing complexity and environmental harm increase
Solution Approach 1:
The patent replaces complex mechanical/physical processes (sputtering, sintering) with a simpler chemical process (electroless plating). This substitution maintains antimicrobial efficacy while dramatically reducing manufacturing complexity and equipment requirements.
Solution Approach 2:
The patent changes the form of copper from nanoparticles to electrolessly plated metal patterns, and changes the manufacturing parameters from high-energy sputtering/sintering to ambient-temperature electroless plating. This achieves the same antimicrobial function with simpler processes.
2Reliability
If continuous copper coating is applied, then antimicrobial coverage is improved, but electrical conductivity increases causing static issues
Solution Approach 1:
The patent divides the continuous copper coating into discrete copper patterns or islands. This segmentation maintains sufficient antimicrobial coverage while breaking electrical continuity, thereby eliminating static electricity problems and electrical conductivity issues.
Solution Approach 2:
The patent applies copper locally in specific patterns rather than as a continuous coating. This local application provides antimicrobial protection where needed while avoiding the creation of electrically conductive pathways across the entire surface.
3Ease of operation
If peelable liners are added for easy application, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The patent incorporates peelable liners that are pre-applied to the copper patterns during manufacturing. This preliminary action protects the copper patterns during storage and handling, and enables easy application by the end user through simple peeling and placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These articles demonstrate high antimicrobial efficacy against bacteria and viruses, with at least 90-99% kill rate within 120 minutes, while maintaining high light transmittance and being safe for handling and application on various surfaces.
Implementation Method 1
an outermost pattern of electrolessly plated copper metal disposed in registration on the catalytic ink pattern
Implementation Method 2
a catalytic ink pattern... that provides the antimicrobial effect
Data Source
AI summary
PROBLEM TO BE SOLVED: To provide a light transmissive electromagnetic shield material having improved light transmittance and electromagnetic shielding performance without causing moire to occur.SOLUTION: The light transmissive electromagnetic shield material has: a transparent substrate 110; and an electromagnetic shield layer 120 provided on the transparent substrate 110. In the light transmissive electromagnetic shield material, the electromagnetic shield layer 120 has a sea region structure in a sea-island structure, and the shapes of island regions 121 made of an opening surrounded by the electromagnetic shield layer 120 differ mutually.