Patterned Copper Antimicrobial Surface for Touchscreen Transparency
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Solution Overview
Problem
Existing antimicrobial technologies face challenges in providing effective, cost-efficient, and environmentally friendly solutions for covering frequently touched surfaces without using copper nanoparticles or sputtering processes, which are costly, labor-intensive, and pose environmental risks.
Innovation Solution
The development of antimicrobial articles comprising a non-electrically conductive substrate with a catalytic ink pattern and electrolessly plated copper metal in registration, applied through flexographic printing and electroless plating, offering high light transmittance and controlled copper metal patterns to inhibit microbial growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles or sputtering processes are used to create antimicrobial surfaces, then antimicrobial effectiveness is improved, but manufacturing cost and environmental risk increase
Solution Approach 1:
The patent changes the manufacturing parameters from nanoscale copper particle deposition or vacuum sputtering to electroless metal plating, which operates under different chemical conditions using aqueous solutions and catalytic reactions. This parameter change maintains antimicrobial effectiveness while eliminating the need for expensive and environmentally risky processes
Solution Approach 2:
The patent replaces mechanical/physical processes (nanoparticle synthesis, sputtering) with a chemical process (electroless plating). The electroless plating uses chemical reduction reactions catalyzed by printed patterns to deposit copper metal, substituting complex mechanical/nanoscale processes with a simpler chemical deposition method that is more cost-effective and environmentally friendly
2Reliability
If continuous copper coating is applied to surfaces, then antimicrobial protection is improved, but electrical interference and light blockage increase
Solution Approach 1:
The patent segments the continuous copper coating into discrete patterns that are printed only on specific high-touch areas using catalytic inkjet printing. This segmentation allows copper to be present where needed for antimicrobial protection while absent from areas where it would cause electrical interference or block light, such as touch screen display areas
Solution Approach 2:
The patent applies local quality by concentrating copper deposition only on specific zones that require antimicrobial protection (buttons, sliders, bezels) while leaving other zones (display areas, non-touch surfaces) free of copper. The catalytic ink patterns serve as localized catalysts that direct copper plating only to designated areas, creating spatially varying properties across the surface
3Object-affected harmful factors
If traditional antimicrobial agents are applied to surfaces, then microbial transmission is reduced, but frequent reapplication and labor-intensive cleaning are required
Solution Approach 1:
The patent implements self-service by creating a passive, long-lasting antimicrobial surface through electroless copper plating that does not require active maintenance or reapplication. The copper metal deposited on the substrate provides continuous antimicrobial protection through its inherent toxicity to microorganisms, eliminating the need for periodic reapplication of chemical agents or labor-intensive cleaning routines
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The antimicrobial articles effectively kill at least 90-99% of bacteria and viruses within 120 minutes, are safe for handling, and can be applied to various surfaces without electrical interference, while avoiding the use of copper nanoparticles and sputtering processes.
Implementation Method 1
a pattern of electrolessly plated copper metal disposed in registration on the catalytic ink pattern
Implementation Method 2
electrolessly plated copper metal disposed in registration on the catalytic ink pattern
Data Source
AI summary
An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.