Patterned Cover Layer for Cavity Alignment in Electronic Packaging

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Solution Overview

Problem

The increasing miniaturization and complexity of electronic components on component carriers pose challenges in heat removal, mechanical robustness, electrical reliability, and precise alignment during manufacturing, particularly in achieving high spatial accuracy and preventing undesired conductive paths.

Innovation Solution

A method involving a patterned cover layer on a base structure to define cavity positions and alignment markers simultaneously, allowing for precise cavity formation and component embedding, with the cover layer preventing material burning during laser cutting and enabling precise alignment and contact formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If miniaturization of electronic components and increasing density are implemented, then product functionality and power increase, but heat removal becomes increasingly difficult and manufacturing precision requirements worsen

Engineering Contradiction:

Improveproduct functionalityVSAvoidspatial accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Alignment markers are formed in advance during the cover layer patterning step, before component embedding and contact formation. This preliminary definition of alignment features enables precise registration during subsequent manufacturing steps, addressing the worsening manufacturing precision challenge while supporting increased component density and functionality.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cover layer serves as an intermediary element that simultaneously defines cavity positions and contains alignment markers. This intermediary structure mediates between the base structure and the embedding process, providing reference features that enable high spatial accuracy in component placement and contact formation, thus resolving the contradiction between increased functionality and manufacturing precision requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If laser cutting is used to form cavities in the base structure, then cavity formation efficiency increases, but material burning and parasitic conductive paths are generated

Engineering Contradiction:

Improvecavity formation efficiencyVSAvoidparasitic conductive paths

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The invention converts the harmful laser-induced material burning into a beneficial process by intentionally allowing controlled charring of the base structure material during laser cutting. The charring step follows laser cutting to create a carbonized layer that is subsequently removed, and this controlled process prevents uncontrolled burning and parasitic conductive path formation while maintaining efficient cavity formation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The cover layer is selectively removed at circumferential openings to expose specific regions of the base structure for laser cutting, while maintaining the cover layer in other regions to prevent burning. This local differentiation allows efficient laser cavity formation in exposed areas while the covered areas protect against parasitic conductive path generation, thus resolving the contradiction between productivity and harmful factor generation.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If alignment markers are defined after cavity formation, then manufacturing flexibility is maintained, but spatial registration accuracy deteriorates

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidspatial registration accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention merges the alignment marker definition with the cavity position definition by forming both features simultaneously during the cover layer patterning step. This combined approach eliminates the need for separate alignment marker fabrication steps, maintaining manufacturing flexibility while achieving high spatial registration accuracy through the common reference framework established by the patterned cover layer.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures high spatial registration accuracy, suppresses parasitic conductive paths, and enhances mechanical and electrical reliability, allowing for efficient heat removal and precise component placement, resulting in a robust and reliable package with improved manufacturing tolerances.

Implementation Method 1

forming a cavity by removing (in particular by cutting out) a section of the base structure within (i.e. delimited by) the circumferential opening

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP3349247B1Patterned cover layer on base structure defining cavity and alignment marker

Publication Date: 2020.12.23 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

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AI summary

A method of manufacturing a package (100), wherein the method comprises providing a patterned cover layer (102) on a front side of a base structure (104) to thereby define a position of a cavity (106) to be formed in the base structure (104) and of at least one alignment marker (108) in a common procedure, forming the cavity (106) at the defined position, and removing material of the base structure (104) from a back side to thereby expose the at least one alignment marker (108).