Patterned Dummy Die Mass Balancing for Substrate Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Circuit board assemblies face substrate warpage due to the mass distribution of chips, which can adversely affect the performance and reliability of semiconductor devices, and existing methods for forming dummy dies to counterbalance this issue are inefficient in terms of processing overhead and material usage.
Innovation Solution
A semiconductor device is developed that includes a dummy die with a stress balance pattern and a stress relief material, where the dummy die is bonded to the substrate and patterned with gaps filled with the stress relief material to counterbalance the mass of the chip, reducing substrate warpage and processing overhead.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a dummy die is added to counterbalance chip mass, then substrate warpage is reduced, but processing overhead and material usage increase
Solution Approach 1:
The dummy die is segmented into multiple sections with varying mass distributions. Instead of using a single solid dummy die, the structure is divided into regions with different material compositions or densities, allowing mass balancing while reducing overall material usage and simplifying processing.
Solution Approach 2:
Different regions of the dummy die are assigned different local properties (mass density, material composition) to achieve counterbalancing only where needed. This localized approach reduces the total mass of the dummy die while maintaining the warpage compensation function, thereby reducing processing overhead.
2Stability of the object's composition
If a dummy die is added to counterbalance chip mass, then substrate warpage is reduced, but material usage increases
Solution Approach 1:
The dummy die structure is segmented into functional and non-functional regions. Only the necessary portions are filled with stress relief material, reducing overall material consumption while maintaining the counterbalancing effect where required.
Solution Approach 2:
The mass density of the dummy die is adjusted by changing material composition or filling ratios in different regions. This allows optimization of material usage while achieving the required counterbalancing mass effect.
3Reliability
If a dummy die with stress balance pattern is formed, then yield is increased, but fabrication complexity increases
Solution Approach 1:
The stress balance pattern is incorporated into the dummy die design from the beginning of the fabrication process. By pre-planning the mass distribution pattern, subsequent processing steps are simplified, and yield is improved without adding significant fabrication complexity.
Data Source
AI summary
A semiconductor device includes a substrate, a chip underlying the substrate, a chip overlying the substrate, and a dummy die overlying the substrate. A pattern of the dummy die includes a first interior sidewall and a second interior sidewall, and a stress relief material between the first interior sidewall and the second interior sidewall to form a dummy die stress balance pattern.