Patterned fiber substrate
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Solution Overview
Problem
Existing methods for forming fine wiring patterns on fiber substrates are complex, limit pattern design freedom, and result in substrates with low bending resistance, particularly when using high-viscosity conductive inks, and require complicated processes for applying conductive materials to via holes in multilayer circuit boards.
Innovation Solution
A patterned fiber substrate with a functional material pattern integrated inside the substrate, featuring a contact angle of 100 to 170° for liquid repellency, narrow line widths, and air permeability of 400 cm3/cm2·s or less, allowing for simpler production and improved bending resistance, and a method involving lyophilic region formation and solvent removal to achieve these characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive ink is screen-printed on the fabric to form wiring patterns, then conductivity is achieved, but fine wiring patterns cannot be formed and the production method is complex
Solution Approach 1:
The patent replaces the mechanical screen-printing process with a chemical etching process using ferric chloride solution. Instead of using screen printing to deposit conductive material, the invention uses photomask alignment and chemical etching to remove non-conductive fabric areas, creating fine wiring patterns through a more precise chemical mechanism rather than mechanical deposition.
Solution Approach 2:
The patent changes the approach from depositing conductive material to removing non-conductive material. By controlling the etching time, ferric chloride concentration, and photomask parameters, fine wiring patterns can be achieved with simpler equipment compared to screen printing, resolving the contradiction between pattern fineness and production complexity.
2Manufacturing precision
If high-viscosity conductive ink is used to reduce bleeding, then pattern definition is improved, but bending resistance decreases because the pattern is only on the surface
Solution Approach 1:
Instead of trying to improve bending resistance by making the surface pattern thicker or more viscous, the patent inverts the approach by creating patterns through removal of material rather than addition. The etched wiring patterns are integrated into the fabric structure itself, providing inherent bending resistance while maintaining sharp pattern definition through the chemical etching process.
3Manufacturing precision
If an underlayer is added to prevent conductive ink spreading, then pattern precision is improved, but the wiring structure becomes thicker and lighter properties are impaired
Solution Approach 1:
The patent extracts and eliminates the unnecessary underlayer component from the wiring structure. By using chemical etching to directly pattern the fabric, the invention removes the need for additional protective or barrier layers, achieving precise patterns while maintaining the original thin and lightweight characteristics of the fabric substrate.
4Ease of manufacture
If conductive yarn is wound into the fiber substrate to form patterns, then pattern formation is achieved, but design freedom is limited
Solution Approach 1:
The patent replaces the mechanical yarn-winding method with a chemical photomask-based etching system. This substitution enables arbitrary pattern designs to be created by simply changing the photomask, providing unlimited design freedom compared to the constrained yarn-winding approach, while maintaining ease of manufacture through a straightforward chemical process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of patterned fiber substrates with fine patterns and excellent bending resistance using a wide range of functional materials, simplifying the production process and addressing the limitations of existing technologies in multilayer circuit boards.
Implementation Method 1
the fiber substrate has a contact angle of 100 to 170° with pure water on its surface
Data Source
AI summary
The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.