Patterned Ground Structure for Semiconductor Package Eddy Current Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor package designs suffer from parasitic eddy currents induced by inductive elements, which degrade performance and heat dissipation capabilities due to the close proximity of the inductive elements to the metal package ground.
Innovation Solution
A patterned ground design with conductive lines or gaps oriented perpendicular to the magnetic field generated by inductive elements, increasing the distance between the inductive elements and the ground plane, thereby reducing eddy currents and enhancing heat dissipation through additional thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a hollow space is added under the inductive element to increase separation from the metal package ground, then eddy currents are reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The ground plane is segmented into multiple conductive lines arranged in a specific pattern rather than using a solid ground plane. This segmentation breaks up the continuous conductive path that would support eddy currents while maintaining sufficient thermal conduction pathways for heat dissipation.
Solution Approach 2:
The ground structure is designed with different local properties: the conductive lines are oriented and spaced to minimize eddy current paths in the region affected by the magnetic field, while maintaining thermal connectivity to ground for heat dissipation. The pattern creates zones with different electrical and thermal characteristics.
2Object-generated harmful factors
If the distance between the inductive element and metal package ground is increased, then eddy currents are reduced, but device complexity increases
Solution Approach 1:
Instead of increasing vertical distance (one dimension), the solution uses a two-dimensional patterned ground plane with conductive lines arranged in specific orientations and spacing. This approach reduces eddy currents through lateral geometry rather than vertical separation, avoiding increased device height and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The patterned ground structure effectively inhibits eddy currents and improves heat dissipation in semiconductor packages by optimizing the distance and orientation of conductive elements, leading to enhanced performance and thermal management.
Implementation Method 1
The inductive element generates a magnetic field that induces or causes eddy currents in the metal package ground
Implementation Method 2
The patterned ground eliminates or substantially reduces the eddy current associated with the inductors or transformers
Implementation Method 3
provides better heat dissipation of heat generated by various components in a semiconductor package
Data Source
AI summary
A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element.