Patterned Heat Sink for Eliminating Lateral Thermal Bloom

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Solution Overview

Problem

Existing heat assisted magnetic recording (HAMR) technologies face challenges in efficiently dissipating heat without causing lateral thermal bloom, which can lead to data errors and increased laser power requirements due to uneven thermal gradients.

Innovation Solution

The method involves fabricating patterned gradient heat sinks with partially patterned heat sink and thermal resistor layers, using materials with varying thermal conductivity to direct heat dissipation along a path of least resistance, preventing lateral thermal bloom and reducing laser power needs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If heat is dissipated through conventional continuous heat sink layers, then heat dissipation occurs, but lateral thermal bloom occurs causing data errors and increased laser power requirements

Engineering Contradiction:

Improvelaser power requirementsVSAvoiddata errors

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The continuous heat sink layer is segmented into patterned regions with different thermal conductivities. The patent divides the heat sink into high thermal conductivity regions (for vertical heat dissipation) and low thermal conductivity regions (for blocking lateral heat flow), preventing lateral thermal bloom while maintaining effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the heat sink are assigned different thermal conductivity properties to perform different functions. High thermal conductivity materials are placed in regions where vertical heat dissipation is needed, while low thermal conductivity materials are placed in regions where lateral heat blockage is required, creating localized thermal management zones.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If uniform thermal conductivity material is used throughout the heat sink, then manufacturing is simplified, but thermal gradient control is insufficient leading to lateral thermal bloom

Engineering Contradiction:

Improveheat sink fabricationVSAvoidthermal gradient stability

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The heat sink is constructed using composite materials with varying thermal conductivities arranged in a patterned structure. This composite approach allows the heat sink to simultaneously achieve good thermal management performance (through high conductivity regions) and lateral heat blockage (through low conductivity regions), resolving the contradiction between manufacturing simplicity and thermal gradient control.

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If high thermal conductivity material is used throughout the heat sink, then heat dissipation is improved, but lateral thermal bloom increases causing adjacent bit interference

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidlateral thermal bloom

Core Design Contradiction:

Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The heat sink is segmented into functional zones: high thermal conductivity regions for efficient vertical heat dissipation and low thermal conductivity regions for blocking lateral heat flow. This segmentation allows the system to achieve both improved heat dissipation efficiency and reduced lateral thermal bloom.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Low thermal conductivity regions act as thermal barriers or intermediaries that block lateral heat flow between adjacent high thermal conductivity regions. These intermediary low conductivity zones prevent thermal interference between adjacent bits while allowing each region to dissipate heat vertically through high conductivity paths.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances thermal gradient stability, reduces laser power requirements, and prevents data errors by efficiently dissipating heat while maintaining high data density in HAMR stacks.

Implementation Method 1

direct heat dissipation along a path of least thermal conduction resistance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using materials with varying thermal conductivity to direct heat dissipation

Methodology Applied

Scientific EffectThermal conductivity gradient: Conduction (thermal)

Data Source

PatentUS9207024B2Patterned heat sink layer for eliminating lateral thermal bloom

Publication Date: 2015.12.08 SEAGATE TECH LLC

AI summary

The embodiments disclose at least one predetermined patterned layer configured to eliminate a physical path of lateral thermal bloom in a recording device, at least one gradient layer coupled to the patterned layer and configured to use materials with predetermined thermal conductivity for controlling a rate of dissipation and a path coupled to the gradient layer and configured to create a path of least thermal conduction resistance for directing dissipation along the path, wherein the path substantially regulates and prevents lateral thermal bloom.