Patterned Insulation Metal Substrate for Power Module Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional power module packages have a poor ability to dissipate heat due to the stacked structure of the metal carrier, insulation layer, and conductive layer, which adversely affects their reliability.
Innovation Solution
A patterned insulation metal substrate (PIMS) is introduced, featuring a metal carrier with a patterned insulation layer partially covering it and a patterned conductive layer on top, allowing for improved heat dissipation by exposing parts of the carrier to the environment and enabling direct connection of semiconductor chips to the conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a full-faced insulation layer is used to cover the metal carrier, then electrical insulation is improved, but heat dissipation ability deteriorates
Solution Approach 1:
The insulation layer is segmented into patterned regions rather than being continuous. The patterned insulation layer includes insulating portions covering specific areas and non-insulating portions exposing the metal carrier, allowing simultaneous electrical insulation where needed and heat dissipation where required.
Solution Approach 2:
Different regions of the substrate are assigned different properties: areas requiring electrical insulation are covered by the patterned insulation layer, while areas requiring heat dissipation expose the metal carrier directly. This local differentiation resolves the contradiction between insulation and heat dissipation.
2Reliability
If a stacked structure of metal carrier, insulation layer, and conductive layer is used, then electrical connectivity is improved, but heat dissipation ability deteriorates
Solution Approach 1:
The stacked structure is segmented in the insulation layer to create pathways for heat dissipation. By patterning the insulation layer, the design maintains electrical connectivity through conductive regions while creating thermal pathways through exposed metal carrier regions.
Solution Approach 2:
The patterned insulation layer acts as an intermediary that selectively allows heat transfer while maintaining electrical insulation. It mediates between the metal carrier and environment, permitting thermal energy transfer in specific regions while blocking electrical current in other regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PIMS design enhances heat dissipation and reliability of power module packages by allowing heat generated from semiconductor chips to be effectively dissipated through the metal carrier, improving their performance compared to traditional designs.
Implementation Method 1
heat generated from semiconductor chips to be effectively dissipated through the metal carrier
Data Source
AI summary
A power module package is provided, including a substrate, a first chip, and a second chip. The substrate includes a metal carrier, a patterned insulation layer disposed on the metal carrier and partially covering the metal carrier, and a patterned conductive layer disposed on the patterned insulation layer. The first chip is disposed on the metal carrier not covered by the patterned insulation layer. The second chip is disposed on the patterned conductive layer and electrically connected to the first chip.