Patterned Insulative Spacer for Optical Semiconductor Positioning
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Solution Overview
Problem
Existing optical semiconductor devices face challenges in achieving compact and cost-efficient designs due to the need for accurate positioning of optical elements, which is not effectively addressed by standard electronics packaging techniques, and they often have large footprints and complex connector pads, making them unsuitable for mass production.
Innovation Solution
A method involving a patterned insulative spacer layer on a multi-layer conductive carrier base sheet to accurately position optical semiconductor elements, allowing for compact device design and reduced manufacturing costs by enabling precise placement of optical elements relative to the semiconductor elements, using existing semiconductor device manufacturing processes without the need for new equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If standard electronics packaging techniques are used, then manufacturing simplicity is maintained, but accurate positioning of optical elements cannot be achieved
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: a carrier substrate, an insulative spacer layer with patterned cavities, and conductor structures. This segmentation allows each layer to perform its specific function (positioning, insulation, electrical connection) independently, achieving precise optical element positioning while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The insulative spacer layer acts as an intermediary component between the carrier substrate and the optical element. It provides mechanical support, defines precise positioning through patterned cavities, and enables electrical isolation while allowing conductor structures to make contact with the optical element, thus resolving the positioning accuracy requirement without complicating the overall packaging structure.
2Area of stationary object
If compact device design is pursued, then footprint is reduced, but connector pad layout becomes awkward and mass production becomes difficult
Solution Approach 1:
The connector pads are arranged in a linear pattern along one dimension of the carrier substrate rather than being distributed across the footprint area. This dimensional arrangement allows for compact device design while maintaining easy access to all connector pads from one side, facilitating automated pick-and-place assembly and mass production processes without awkward routing.
3Manufacturing precision
If multi-layer carrier structure is implemented, then positioning precision is improved, but manufacturing process complexity increases
Solution Approach 1:
The insulative spacer layer uses parameter changes in its cavity dimensions and patterns to achieve precise positioning. By varying the cavity size, shape, and distribution according to the specific optical element requirements, the same multi-layer structure can accommodate different positioning precision needs without changing the fundamental structure, thus improving positioning precision while controlling manufacturing complexity through parameter optimization rather than structural redesign.
Data Source
AI summary
A method for providing, on a carrier (40), an insulative spacer layer (26) which is patterned such that a cavity (27) is formed which enables connection of an optical semiconductor element (41) to the intended conductor structure (22) when placed inside the cavity (27). The cavity (27) is formed such that it, through its shape, extension and/or depth, accurately defines a location of an optical element (45; 61) in relation to the optical semiconductor element (41). Through the provision of such a patterned insulative spacer layer, compact and cost-efficient optical semiconductor devices can be mass-produced based on such a carrier without the need for prolonged development or acquisition of new and expensive manufacturing equipment.