Patterned Laser Beam Processing for Maskless Microfabrication

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Solution Overview

Problem

Conventional lithographic processes for micro-electronics manufacturing are costly and inefficient, requiring multiple patterning and material processing steps that can be streamlined to reduce costs and increase throughput.

Innovation Solution

A laser manufacturing system utilizing an optically addressed light valve to direct a patterned laser beam for both ablative material removal and induction of chemical reactions, enabling two-dimensional patterning and processing of materials with high precision and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional lithographic processes are used for micro-electronics manufacturing, then material processing and patterning can be achieved, but the process cost increases and manufacturing throughput decreases due to multiple patterning and material processing steps

Engineering Contradiction:
Improvemanufacturing throughputVSAvoidnumber of processing steps
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines multiple patterning and material processing steps into a single laser-based process. The system integrates photolithography patterning with laser ablation and laser-induced chemical reactions, eliminating the need for separate etching and deposition equipment and processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The laser system performs multiple functions simultaneously: it patterns the resist, removes material through ablation, induces chemical reactions for material transformation, and creates complex 3D structures. This multi-functional approach replaces multiple specialized processing tools.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple patterning and material processing steps are used, then desired material properties and complex patterns can be achieved, but the process cost increases

Engineering Contradiction:
Improvespatial control precisionVSAvoidprocess cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces mechanical and chemical processing systems (photomasks, etching chemicals, deposition equipment) with a laser-based system. The laser provides precise spatial control through optical focusing and scanning, eliminating the need for expensive photomasks and multiple material processing chambers.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system controls material transformation by adjusting laser parameters such as pulse duration, intensity, wavelength, and scanning speed. This allows precise control over ablation depth, chemical reaction extent, and pattern geometry without changing physical processing conditions or materials.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If conventional lithography with photomasks is used, then pattern transfer can be achieved, but the equipment cost and process complexity increase

Engineering Contradiction:
Improvepattern accuracyVSAvoidequipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the patterning function from the complex lithography system and implements it directly through laser writing. This eliminates the need for photomasks, alignment systems, and multiple development/etching stations, while maintaining or improving pattern accuracy through direct laser writing.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system allows for precise spatial control and efficient processing of micro-electronic components by integrating multiple patterning and material transformation steps into a single process, reducing costs and enhancing manufacturing throughput while achieving desired material properties.

Implementation Method 1

the patterned laser beam ablatively removing material from the part

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

the patterned laser beam can further induce selected chemical reactions in part material

Methodology Applied
Scientific EffectPhotochemical reaction: Photopolymerisation

Implementation Method 3

the patterned laser beam can further laser peen part material

Methodology Applied
Scientific EffectLaser peening: Laser Peening

Data Source

PatentUS20240139882A1Laser Beam Shaping and Patterning for Manufacturing
Publication Date: 2024.05.02 SEURAT TECHNOLOGIES INC
  • US20240139882A1 patent drawing
  • US20240139882A1 patent drawing
  • US20240139882A1 patent drawing

AI summary

A laser manufacturing system includes a laser patterning unit having an optically addressed light valve and an image relay able to direct a patterned laser beam from the laser patterning unit against a part. In some embodiments the patterned laser beam can ablatively remove material from the part or induce selected chemical reactions or transformation in part material.