Patterned Layer Milling for Thick Copper on Flexible Substrates
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Solution Overview
Problem
Existing methods for manufacturing electrical conductors and components on flexible substrates are inefficient due to the need for multiple steps, high waste generation, and environmental concerns, particularly when dealing with thick or hard-to-machine materials like copper, which require high cutting forces and result in poor quality and reduced speed.
Innovation Solution
A method involving a multilayer material passed through a series of nips formed by a milling cutter and a patterned cliché cylinder, allowing partial removal of material in the first nip and complete removal in subsequent nips, using the same or different cutters and patterns, to achieve high-quality patterns on materials with thicknesses greater than 40 μm, including copper, while minimizing environmental impact and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single-step milling method is used to remove material from thick conductive layers (>40 μm), then manufacturing speed is improved, but cutting forces increase and pattern quality deteriorates
Solution Approach 1:
The patent divides the material removal process into multiple sequential steps (first nip for partial removal, second nip for complete removal) rather than attempting to remove all material in a single step. This segmentation reduces the cutting forces required at each individual step while maintaining high manufacturing speed, specifically addressing the contradiction between productivity and force for thick conductive layers exceeding 40 μm
2Manufacturing precision
If chemical etching is used to create patterns on conductive layers, then pattern quality is improved, but environmental harm and waste management problems worsen
Solution Approach 1:
The patent replaces chemical etching processes with a mechanical milling system consisting of a patterned cliché and milling cutter. This mechanical approach achieves high-quality conductive patterns without the environmental harm and waste management issues associated with chemical substances, directly resolving the contradiction between manufacturing precision and environmental impact
3Manufacturing precision
If multiple separate process steps are used to manufacture conductive patterns, then pattern quality is maintained, but productivity decreases
Solution Approach 1:
The patent combines multiple functions (pattern formation and material removal) into a single integrated mechanical milling step using a patterned cliché and milling cutter. This merging of operations eliminates the need for separate chemical etching and rinsing steps, thereby maintaining pattern quality while significantly improving productivity through continuous high-speed processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases milling speed and quality, reduces cutting forces, and allows for cost-effective production of high-quality patterns on thick and hard-to-machine materials, such as copper, while being environmentally friendly.
Implementation Method 1
a milling cutter cooperating with a patterned cliché cylinder, to selectively remove predetermined portions of material from at least a first layer of the multilayer material
Data Source
AI summary
The document relates to a method of producing a product comprising a substrate with at least one 2D-patterned layer from a multilayer material (1), wherein the multilayer material (1) is passed through at least one nip (6, 6a, 5 6b), provided by a milling cutter (51, 51a, 51b) cooperating with a patterned cliche cylinder (52, 52a, 52b), to selectively remove predetermined portions of material from at least a first layer (10) of the multilayer material (1) in accordance with a pattern of the patterned cliché cylinder (52, 52a, 52b), whereby the 2D-patterned layer is formed from the first layer (10). The method comprises: providing the multilayer material (1) comprising at least the first layer (10) and a second layer (20); feeding the multilayer material (1) through a first such nip (6, 6a) to partially, as seen in a thickness direction of the first layer (10), remove at least some of the predetermined portions of material from the first layer (10); and feeding the multilayer material (1) through a second such nip (6, 6b) to remove a remainder of said at least some of the predetermined portions of material.