Patterned Metal Foil Laminate Production via Masking
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Solution Overview
Problem
Existing methods for producing thin printed wiring boards and substrates for semiconductor devices face challenges such as material waste, breakage, and limited versatility due to the use of support substrates, which hinder thickness reduction and efficient production processes.
Innovation Solution
A method involving the lamination of metal foils on both surfaces of a thin insulating resin layer, with selective masking and patterning of one surface, allowing for the production of patterned metal foils without breaking the insulating layer, eliminating the need for support substrates and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If support substrates are used to produce thin printed wiring boards, then manufacturing stability is improved, but material waste increases and production versatility deteriorates
Solution Approach 1:
The invention extracts and eliminates the support substrate from the production process. By directly forming metal foil patterns on thin insulating resin layers without requiring support substrates, the method removes the source of material waste while maintaining manufacturing stability through the self-supporting structure of the laminate.
Solution Approach 2:
The invention performs preliminary lamination of metal foils on both surfaces of the thin insulating resin layer before any patterning operations. This preliminary action creates a structurally stable laminate that can withstand subsequent processing steps without requiring support substrates, thereby preventing material waste while ensuring manufacturing stability.
2Ease of manufacture
If support substrates are used for thickness reduction, then production feasibility is improved, but process versatility deteriorates due to mandatory laminate structure
Solution Approach 1:
The invention creates a universal production method that can handle various laminate configurations without requiring support substrates. The method accommodates different metal foil arrangements (single-sided or double-sided patterning) and insulating layer thicknesses, providing multi-functionality and process versatility while maintaining production feasibility.
Solution Approach 2:
By performing preliminary lamination of metal foils on both surfaces before patterning, the invention creates a versatile platform that can accommodate different design requirements. This preliminary structure enables flexible subsequent processing operations without being constrained by support substrate requirements, thereby improving both ease of manufacture and process versatility.
3Strength
If insulating layer thickness is increased to prevent breakage, then structural stability is improved, but thickness reduction goal deteriorates
Solution Approach 1:
The invention uses composite material structure with metal foils laminated on both surfaces of the thin insulating resin layer. This composite structure provides enhanced structural stability and strength while maintaining thin overall thickness, as the metal foil layers reinforce the thin insulating layer without requiring it to be thicker for structural integrity.
Solution Approach 2:
The preliminary lamination of metal foils on both surfaces creates a reinforced composite structure before any patterning or processing. This preliminary reinforcement allows the use of thin insulating resin layers (1-200 μm) while maintaining structural stability throughout subsequent manufacturing steps, achieving both thickness reduction and structural integrity.
4Length of moving object
If support substrate peeling is performed, then thin laminate production is improved, but production complexity and material waste increase
Solution Approach 1:
The invention extracts and eliminates the support substrate peeling step from the production process. By directly forming the final laminate structure without support substrates, the method removes the complex peeling operation and associated material waste, simplifying the production process while achieving thin laminate dimensions.
Solution Approach 2:
The preliminary lamination of metal foils on both surfaces of the thin insulating resin layer creates a self-supporting structure that eliminates the need for support substrates. This preliminary action simplifies the overall production process by removing subsequent peeling steps, reducing production complexity while maintaining thin laminate thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of thin, versatile laminates suitable for thickness-reduced printed wiring boards and substrates with reduced material waste and improved process flexibility, allowing for efficient use in semiconductor device applications.
Implementation Method 1
a first metal foil, a first insulating resin layer having a thickness of 1 to 200 μm and a second metal foil are laminated in this order
Implementation Method 2
a resist film is laminated on the whole surface of the first metal foil for masking
Data Source
AI summary
The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 μm and a second metal foil laminated in this order, and patterning the second metal foil.