Patterned Microwire Bundle Manufacturing via Multiclad Segmentation

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Solution Overview

Problem

Current high-density neural recording probes face challenges in achieving optimal electrical recording and stimulation quality while ensuring biological safety and ease of manufacturing, integration with electronic devices, and precise control over microwire spacing and organization.

Innovation Solution

A method for forming a bundle of microelectrodes involves coating microwires with multiple cladding layers, arranging them in specific patterns, and securing them together using heat shrink tubing or a rigid tube, with selective removal of cladding layers to expose conductors and modify tips for improved recording and stimulation capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple cladding layers are applied to microwires to control spacing and organization, then microwire spacing precision is improved, but device complexity increases

Engineering Contradiction:

Improvemicrawire spacing controlVSAvoidmulticlad structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The microwire structure is segmented into multiple functional cladding layers (first cladding layer for spacing control, second cladding layer for organization and protection). Each layer serves a specific function, allowing independent optimization of spacing precision and structural complexity management.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from single-layer to multi-layer cladding architecture, adding a dimensional layer of complexity that enables precise three-dimensional positioning and organization of microwires within the bundle, thereby achieving superior spacing control.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If microwires are arranged in specific patterns and secured with heat shrink tubing or rigid tubes, then organizational precision is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvemicrawire organizationVSAvoidbundle assembly

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Microwires are pre-coated with cladding layers and pre-arranged in specific patterns before final bundling. This preliminary organization simplifies the subsequent assembly process, as the wires are already positioned correctly and ready for securement with heat shrink tubing or rigid tubes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Heat shrink tubing or rigid tubes serve as intermediary elements that facilitate the securement of organized micrawire bundles. These intermediaries simplify the manufacturing process by providing a straightforward method to maintain precise organization without requiring complex fixation mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If cladding layers are selectively removed to expose conductors, then electrical recording quality is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveelectrical recording qualityVSAvoidcladding removal precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

Cladding layers are selectively removed only at specific locations where electrical recording is required, while maintaining intact cladding in other regions for protection and organization. This localized removal approach optimizes electrical recording quality without compromising overall structural integrity, and reduces the precision burden to specific critical zones rather than the entire wire length.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the quality of neural recordings and stimulations, minimizes tissue disruption, and facilitates integration with electronic devices by controlling microwire spacing and organization, thereby improving the performance and safety of neural probes.

Implementation Method 1

a second cladding layer which is shaped to control an organization of the stack of cut multiclad micrawires

Methodology Applied

Scientific EffectMechanical constraint: Mechanical Force

Implementation Method 2

a stack of cut multiclad micrawires which is secured together by clamping the cut multiclad micrawires in a heat shrink tubing

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS11401620B2Method of producing patterned microwire bundles

Publication Date: 2022.08.02 PARADROMICS INC

AI summary

Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.