Patterned Mold Layer for Flexible Optical Device Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing flexible optical devices, such as LCDs, face issues with residual film thickness during the imprinting process, leading to increased driving voltage and potential short circuits due to the residual film outside the pillar shape, and complexity in photo patterning processes.
Innovation Solution
A method involving the formation of a patterned mold layer in a pillar shape on a lower base film, followed by the deposition of a lower electrode layer and imparting insulating properties to prevent short circuits and reduce residual film thickness, using materials like ITO and curable resins, and adjusting the pillar shape and adhesive force to maintain a suitable gap between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the imprinting process is used to form a pillar pattern with a thickness of about 10 μm, then the desired pillar shape can be easily formed, but a residual film having a thickness of about 3 to 5 μm remains in regions other than the pillar shape, leading to increased driving voltage
Solution Approach 1:
The patent extracts and removes the harmful residual film from regions outside the pillar pattern using a photoresist-based patterning process. By applying a photoresist layer and performing photolithography, the residual film is selectively removed only from non-pillar regions, thereby eliminating the source of increased driving voltage while preserving the easily-formed pillar structure.
Solution Approach 2:
The patent applies a preliminary photoresist coating and patterning step before final assembly. This preliminary action of forming a patterned photoresist mask allows for selective removal of residual film in subsequent processing steps, preventing the residual film from causing driving voltage issues in the final device.
2Manufacturing precision
If a photo patterning process is applied to remove the residual film, then no residual film remains and driving voltage is reduced, but the manufacturing process becomes more complicated
Solution Approach 1:
The patent merges the photoresist patterning process with the existing manufacturing workflow by integrating it as a standard intermediate step. The photoresist application, exposure, and development processes are combined with the pillar formation and subsequent assembly steps, creating a unified manufacturing sequence that achieves precise residual film removal without requiring separate complex processing lines.
Solution Approach 2:
The patent employs a photoresist layer that serves multiple functions: it acts as a protective layer during processing, a patterning mask for selective film removal, and a guide for subsequent alignment steps. This multi-functionality reduces the need for additional specialized materials and processes, thereby simplifying the overall manufacturing complexity while maintaining high precision.
3Ease of manufacture
If the residual film remains on the substrate, then the manufacturing process is simpler, but short circuits may occur between electrodes
Solution Approach 1:
The patent applies local quality by selectively removing the residual film only from specific regions where electrodes will be placed, while leaving the film intact in other areas. The photoresist patterning creates localized zones of film removal precisely where electrical contacts are needed, ensuring that short circuits are prevented in non-contact areas while maintaining manufacturing simplicity elsewhere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces driving voltage, prevents short circuits, and simplifies the manufacturing process by forming the patterned mold layer first, allowing for flexible and efficient production of optical devices suitable for roll-to-roll processing.
Implementation Method 1
forming a patterned mold layer in a pillar shape on a lower base film
Implementation Method 2
forming a lower electrode layer on the patterned mold layer
Data Source
AI summary
The present application relates to a method of manufacturing an optical device, an optical device and a use of the optical device. The method of manufacturing an optical device of the present application can form a patterned mold layer to maintain an appropriate gap between the upper and lower substrates, and can apply an imprinting process in patterning the mold layer to simply manufacture the mold pattern having the desired shape. In addition, the optical device manufactured by the above manufacturing method can have a low driving voltage and no short circuit phenomenon, and be realized as a flexible device. Such an optical device can be applied to various display devices such as LCDs.