Patterned Nanoparticle Nanostructures for Scalable Sub-Micron Fabrication
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Solution Overview
Problem
Current manufacturing techniques for semiconductors and nanostructures are limited by being expensive, wasteful, and unable to efficiently produce patterned structures at sub-micron lengths, particularly for crystalline and conducting compositions, and are not easily scalable.
Innovation Solution
The use of electromagnetic radiation with a patterned mold and nanoparticle compositions to form patterned nanostructures with feature sizes below 5 microns, employing methods like nanoimprint lithography, photolithography, and nanoinscribing to create three-dimensional structures with controlled optoelectronic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional subtractive manufacturing techniques are used for semiconductors, then material can be built up and removed through mask/etch processes, but the process becomes expensive and wasteful
Solution Approach 1:
The patent replaces traditional mechanical subtractive manufacturing processes (masking and etching) with a direct-write additive approach using inkjet dispensing. This substitution eliminates material removal steps, thereby reducing material waste while maintaining manufacturing precision for sub-micron features
Solution Approach 2:
The invention changes the manufacturing approach from bulk material processing to nanoparticle-level precision deposition. By using nanoparticles with controlled size distribution and direct-write dispensing, the process achieves high precision without the material waste inherent in subtractive methods
2Ease of manufacture
If direct write techniques are used to produce patterns of metal oxides, then additive process can be used, but the process is slow and limited to large micron scale dimensions
Solution Approach 1:
The patent segments the material into individual nanoparticles with sizes below 100 nm, allowing parallel deposition through multi-nozzle arrays. This segmentation enables the additive process to achieve both ease of manufacture and high productivity by simultaneously depositing multiple nanoparticle streams
Solution Approach 2:
The invention transitions from two-dimensional planar patterning to three-dimensional vertical structure formation by stacking patterned nanoparticle layers. This dimensional transition enables complex 3D nanostructures to be manufactured at high speed through sequential layer deposition
3Ease of manufacture
If direct write techniques are used for metal oxides, then additive process can be used, but it is unable to manipulate semi-crystalline, crystalline or conducting compositions at low temperature
Solution Approach 1:
The patent changes the material state from bulk to nanoparticle form, which fundamentally alters the thermal processing requirements. Nanoparticles with high surface area to volume ratio can be sintered and crystallized at low temperatures, enabling the additive process to manipulate semi-crystalline, crystalline, and conducting compositions without high temperature processing
4Ease of manufacture
If traditional manufacturing techniques are used, then conventional processes can be applied, but they are not easily scalable
Solution Approach 1:
The patent creates a universal nanoparticle-based additive manufacturing platform that can produce diverse nanostructures (wires, dots, patterns) through a single direct-write process. This multi-functional approach enables easy scaling from laboratory to production by simply adjusting dispensing parameters rather than redesigning entire manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed, scalable production of patterned nanostructures with sub-micron features, minimizing volume contraction during calcination and allowing for controlled manipulation of electromagnetic properties, suitable for various applications.
Implementation Method 1
using electromagnetic radiation in cooperation with a patterned mold and/or mask to manipulate the nanoparticle composition and form the patterned nanostructure
Implementation Method 2
Direct write techniques have been used as an additive process to produce patterns of metal oxides and other materials by precipitation and coagulation of inks dispensed from nozzles
Implementation Method 3
Direct write techniques have been used as an additive process to produce patterns of metal oxides and other materials by precipitation and coagulation of inks dispensed from nozzles
Data Source
AI summary
Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure for suitable applications.