Patterned Package Stiffeners for Semiconductor Warpage Modulation
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Solution Overview
Problem
Semiconductor package warpage caused by coefficient of thermal expansion (CTE) mismatches and thermal processing steps leads to yield losses in high-volume manufacturing (HVM).
Innovation Solution
A patterned stiffener with a metallic body is used, which is attached to a semiconductor device platform to provide rigidity. The stiffener is modulated by exposing it to localized heating, typically through laser ablation, to alter its shape and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a stiffener is added to improve package substrate strength and minimize warpage, then the durability and rigidity are improved, but the cost and manufacturing time increase
Solution Approach 1:
The patent applies laser heating to change the physical state and shape of the stiffener by controlling temperature parameters. The stiffener is heated to a temperature range (e.g., 100°C to 500°C) that allows it to deform and conform to the package substrate, achieving the desired shape without additional manufacturing steps or materials.
Solution Approach 2:
The patent replaces traditional mechanical methods of stiffener attachment and shaping with laser heating. Instead of using mechanical fasteners, adhesives, or complex assembly tools, the solution uses thermal energy from a laser to directly modify the stiffener's shape and secure it to the substrate, reducing manufacturing time and complexity.
2Strength
If a stiffener is added to improve package substrate strength and minimize warpage, then the durability and rigidity are improved, but the cost increases
Solution Approach 1:
The patent uses laser heating to change the stiffener's physical properties and shape, allowing for a simpler, more cost-effective manufacturing process. By controlling temperature and exposure time, the stiffener can be precisely shaped to match the package substrate without requiring expensive mechanical processing or additional materials.
Solution Approach 2:
The patent replaces costly mechanical assembly operations with laser heating technology. The laser system provides a non-contact, automated method for shaping and attaching the stiffener, eliminating the need for manual labor, mechanical fasteners, or complex tooling, thereby reducing overall manufacturing costs.
3Stability of the object's composition
If global solutions are used to balance CTEs of different components, then the CTE mismatches are addressed, but the package warpage remains beyond acceptable thresholds
Solution Approach 1:
The patent applies laser heating to specific local areas of the stiffener rather than using global CTE balancing approaches. By targeting specific regions that exhibit warpage, the laser selectively modifies the stiffener's shape and stress distribution in those areas, achieving precise warpage control without altering the overall CTE balance of the entire package.
Solution Approach 2:
The patent uses controlled temperature changes via laser heating to modify the stiffener's physical state and shape. By adjusting the laser power, exposure time, and scanning pattern, the process precisely controls the degree of deformation in targeted areas, enabling fine-tuned warpage correction that global CTE balancing methods cannot achieve.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively modulates the stiffener to achieve uniform warpage profiles, improving semiconductor package yields and allowing for warpage correction at any stage of the assembly process.
Implementation Method 1
The stiffener is modulated by exposing it to localized heating, typically through laser ablation, to alter its shape and reduce warpage.
Data Source
AI summary
The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.