Patterned PCB Plane Edges for RF Resonance Mitigation
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Solution Overview
Problem
Circuit boards experience resonance issues in power/ground planes that lead to RF interference and signal integrity problems, particularly in miniaturized designs with integrated 5G antennas, where traditional noise reduction methods are costly and limit miniaturization.
Innovation Solution
Modifying the edge regions of circuit board layers by creating patterns of non-parallel cuts, such as triangular shapes, to gradually change impedance and disperse electromagnetic reflections, reducing resonance intensity and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional noise reduction methods are used, then resonance is reduced, but cost increases and board area is consumed
Solution Approach 1:
The patent applies segmentation by dividing the continuous power plane edge into multiple discrete cut sections. The cut pattern creates segmented regions that disrupt resonance propagation while maintaining the overall plane integrity. This segmentation approach reduces resonance interference without requiring additional components or sacrificing board area.
Solution Approach 2:
The patent transitions from a two-dimensional plane to a three-dimensional structure by creating cuts with specific depths and angles. The cut depth varies (e.g., first cut at 0.5mm, second cut at 1.0mm) to create impedance transitions in the vertical dimension, effectively reducing resonance without consuming horizontal board area.
2Object-affected harmful factors
If traditional noise reduction methods are used, then resonance is reduced, but manufacturing cost increases
Solution Approach 1:
The patent merges the resonance reduction function with the existing PCB manufacturing process by integrating cut patterns directly into the board fabrication. The cuts are created during standard manufacturing steps (routing, drilling, or laser cutting) rather than requiring separate assembly operations, thereby reducing manufacturing cost while achieving resonance suppression.
3Area of stationary object
If miniaturization is pursued, then board area is reduced, but resonance control becomes more difficult
Solution Approach 1:
The patent applies local quality by creating non-uniform cut patterns with varying depths, angles, and spacings at different locations. The first cut has depth of 0.5mm while the second cut has depth of 1.0mm, and angles vary (e.g., 45 degrees and 60 degrees). This localized variation optimizes resonance control in miniaturized designs without requiring overall board area expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively alleviates RF interference and signal integrity issues by smoothing impedance transitions, allowing for reduced resonance intensity without compromising available board area for circuitry.
Implementation Method 1
creating a cut pattern in the edge of the plane by creating a plurality of the cuts along the edge of the plane such that an impedance of the plane at the depth is different than an impedance of the plane at the edge of the plane
Implementation Method 2
disperse electromagnetic reflections, reducing resonance intensity and interference
Data Source
AI summary
Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.