Patterned Seed Layer Layout for Uniform Copper Electroplating
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Solution Overview
Problem
The uneven thickness distribution of electroplated copper layers due to uneven plating solution and current density during the manufacturing of electronic devices affects the curvature and reliability of the devices.
Innovation Solution
A method involving the formation of a patterned seed layer with separated sub-seed layers and conductive lines, including protrusions and gaps to reduce current density and electric field unevenness, followed by electroplating a metal layer, which is then patterned to improve thickness uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroplating is performed using conventional continuous seed layers, then the manufacturing process is simple, but the electroplated copper layer exhibits uneven thickness distribution affecting device reliability
Solution Approach 1:
The continuous seed layer is divided into multiple separated sub-seed layers (first sub-seed layer and second sub-seed layer) with gaps between them. This segmentation allows for more uniform current distribution during electroplating, resulting in even copper layer thickness and improved electrical reliability without excessive complexity
Solution Approach 2:
The patent applies different properties to different regions: the sub-seed layers have conductive properties while the gaps between them are non-conductive. This local differentiation enables precise control of current density in specific areas, ensuring uniform electroplating thickness and resolving the reliability issue
2Manufacturing precision
If electroplating is performed with conventional uniform seed layers, then the process is straightforward, but uneven current density and electric field result in non-uniform copper layer thickness
Solution Approach 1:
By segmenting the seed layer into separated sub-seed layers, the patent creates multiple independent electroplating zones. Each sub-seed layer receives more uniform current density, resulting in consistent copper thickness across the entire structure while maintaining a relatively simple manufacturing process
Solution Approach 2:
The separated sub-seed layers are designed to create more uniform electric field distribution during electroplating. By spacing them appropriately, the patent achieves equipotential conditions across different regions, ensuring uniform current density and consistent copper layer thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical reliability of electronic devices by ensuring uniform thickness and reducing curvature issues, thereby improving the overall performance.
Implementation Method 1
a metal layer is formed on at least one of the sub-seed layers
Data Source
AI summary
The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.