Patterned Substrate Temperature Measurement for Bonding Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding devices and systems face challenges in accurately measuring substrate temperature during the bonding process due to indirect temperature measurement methods, which result in low accuracy, noise interference, and calibration requirements, making it difficult to meet design constraints and achieve high precision.
Innovation Solution
A direct temperature measurement method using a temperature probe with a pattern that changes shape according to the substrate's temperature, allowing for contact-based measurement without calibration needs, and enabling accurate analysis through image capturing and Fourier transformation, while being compact enough to fit within the bonding device's design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a pyrometer is used for temperature measurement, then the measurement can be performed at a distance from the substrate, but the measurement accuracy decreases due to noise and interference
Solution Approach 1:
The patent introduces a patterned intermediate layer on the substrate surface that acts as a mediator between the heating source and the pyrometer. This patterned layer modulates the infrared radiation emitted by the substrate, creating a detectable signal that allows accurate temperature measurement at a distance while avoiding direct interference from nearby heat sources.
Solution Approach 2:
The patent utilizes changes in infrared radiation characteristics (analogous to color changes in visible light) of the patterned substrate surface at different temperatures. The patterned structure exhibits temperature-dependent infrared emission properties that enable the pyrometer to distinguish substrate temperature from interfering radiation sources through spectral or intensity analysis.
2Ease of operation
If a pyrometer is used for temperature measurement, then the measurement can be performed without contact, but calibration is required for different substrate materials which increases processing steps
Solution Approach 1:
The patent applies a uniform patterned layer across the substrate surface that standardizes the infrared emission characteristics regardless of the underlying substrate material. This homogenization of the radiation interface eliminates the need for material-specific calibration, as the patterned layer becomes the dominant factor in infrared emission rather than the diverse substrate materials.
Solution Approach 2:
The patterned substrate preparation serves multiple functions: it enables accurate temperature measurement, provides a standardized radiation interface for different materials, and creates a detectable signal pattern. This multi-functional approach allows a single pyrometer setup to measure temperatures across various substrate materials without requiring recalibration for each material type.
3Device complexity
If the pyrometer is placed far from the substrate to fit within the bonding device housing, then the design requirements are met, but the measurement accuracy decreases
Solution Approach 1:
The patterned substrate creates distinct infrared radiation patterns that maintain their characteristic signal even at increased distances. The patterned structure enhances the detectability of temperature-related radiation changes, allowing accurate measurement from a greater distance that accommodates the bonding device housing constraints.
Solution Approach 2:
The substrate surface is segmented into a patterned structure that creates spatially distributed infrared emission zones. This segmentation allows the pyrometer to detect temperature information through the pattern modulation even when positioned at a distance, effectively decoupling measurement accuracy from proximity requirements.
4Ease of operation
If indirect temperature measurement is used, then the measurement can be performed without contact, but heat sources in the vicinity interfere with the measurement accuracy
Solution Approach 1:
The patterned substrate layer serves as an intermediary that selectively emits or modulates infrared radiation in response to substrate temperature while being less affected by nearby heat sources. This intermediate structure filters out interfering radiation and transmits only the temperature-related signal to the pyrometer, enabling accurate non-contact measurement in the presence of vicinal heat sources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature measurement accuracy, reduces processing steps and costs, and complies with design requirements by providing a direct, contact-based measurement that is not dependent on substrate material or location, ensuring precise temperature control during the bonding process.
Implementation Method 1
the first surface comprises a pattern configured to change its shape according to the temperature of the surface of the substrate
Implementation Method 2
an image capturing device is configured to capture a current shape of the pattern, wherein a control unit is configured to determine a temperature profile by evaluating the captured shape of the pattern
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention provides a bonding device 100 for bonding semiconductor devices to a substrate 101. The bonding device 100 includes a temperature probe 102 comprising a first surface 103, wherein the first surface 103 is configured to contact a surface 104 of the substrate 101 to measure a temperature of the surface 104 of the substrate 101. The first surface 103 further comprises a pattern 105 configured to change its shape according to the temperature of the surface 104 of the substrate 101.