Patterned Substrate Film Peeling for Contaminant Removal
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Solution Overview
Problem
Existing substrate processing methods struggle to efficiently remove contaminants from substrates with complex patterns, as the processing film can reattach contaminants to the substrate during removal, leading to incomplete cleaning.
Innovation Solution
A substrate processing method involving a processing liquid that forms a thin film following the substrate's pattern, a peeling liquid that dissolves and splits the film, and a controlled rotation to ensure efficient removal of contaminants without reattachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the processing film is made thicker to hold removal objects more effectively, then removal object holding is improved, but the film becomes harder to remove completely
Solution Approach 1:
The processing film is segmented into upstream and downstream sections with different thicknesses. The upstream section is thicker to provide strong holding strength for removal objects, while the downstream section is thinner to facilitate easy removal and complete dissolution, thus resolving the contradiction between holding strength and removal ease.
Solution Approach 2:
The film thickness parameter is changed along the flow direction - greater in the upstream section for strong holding and lesser in the downstream section for easy removal. This parameter variation resolves the contradiction by allowing the film to have both strong holding capability and easy removability in different locations.
2Productivity
If the processing liquid is supplied at high flow rate to remove contaminants quickly, then productivity is improved, but the processing liquid may not properly penetrate the patterned surface
Solution Approach 1:
The processing liquid is supplied in a controlled manner that allows it to first penetrate and wet the patterned surface properly before carrying out removal objects. This preliminary penetration action ensures that even at high flow rates, the liquid maintains sufficient contact with the patterned surface to effectively reach and remove contaminants from recessed portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the film thickness and strength, allowing the peeling liquid to reach and remove contaminants efficiently, preventing reattachment and ensuring thorough cleaning.
Implementation Method 1
a processing liquid supplied to an upper surface of a substrate, the processing liquid is solidified or cured to form a processing film
Implementation Method 2
a dissolution processing liquid is supplied to the upper surface of the substrate. Thereby, since the processing film is dissolved on the substrate and removed
Data Source
AI summary
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid to a patterned surface of a substrate having the patterned surface with projections and recesses, a processing film forming step of solidifying or curing the processing liquid supplied to the patterned surface to form, so as to follow the projections and the recesses of the patterned surface, a processing film which holds a removal object present on the patterned surface and a removing step of supplying a peeling liquid to the patterned surface to peel the processing film from the patterned surface together with the removal object, thereby removing the processing film from the substrate, while such a state is kept that the removal object is held by the processing film.