Patterned Surface Treatment Layer for Electronic Package Thermal Shock Reliability

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Solution Overview

Problem

Conventional semiconductor packaging technologies face reliability issues due to poor adhesion between copper pads and semiconductor chips caused by thermal expansion and contraction, leading to misalignment or separation, and the use of strengthening layers increases production costs.

Innovation Solution

A semiconductor package design featuring a patterned metal layer with a surface treatment layer and a bonding layer that contacts both the functional pad and the surface treatment layer, using different metal materials and a conductive or insulating adhesive, which improves adhesion and reduces production costs by only applying the surface treatment to parts of the functional pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a strengthening layer is formed on the entire top surface of the copper pad to strengthen bonding with the adhesive, then the bonding strength between the copper pad and adhesive is improved, but the adhesiveness between the adhesive and the semiconductor chip is weakened

Engineering Contradiction:

Improvebonding strength between copper pad and adhesiveVSAvoidadhesiveness between semiconductor chip and adhesive

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent applies surface treatment (such as oxidation, nitridation, or coating with specific metal layers) only to specific regions of the copper pad surface rather than the entire surface. This creates local variations in surface properties, allowing the treated regions to provide strong bonding with the adhesive while leaving other regions to maintain good adhesiveness with the semiconductor chip.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The copper pad surface is divided into multiple regions with different surface treatments or characteristics. Some regions are treated to enhance bonding strength, while other regions are left untreated or treated differently to preserve chip adhesion, thus segmenting the functional requirements across different surface zones.

Inventive Principle:

Principle #1Segmentation

2Strength

If a strengthening layer is formed on the copper pad to improve bonding, then the bonding strength is improved, but the production cost increases

Engineering Contradiction:

Improvebonding strength between copper pad and adhesiveVSAvoidproduction cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

Instead of applying costly strengthening layers across the entire copper pad surface, the patent applies surface treatment only to specific regions where enhanced bonding is needed. This localized approach significantly reduces material costs and processing time while still achieving the required bonding strength in critical areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies surface treatment to only the necessary portions of the copper pad surface rather than the entire surface. This partial action approach achieves the required bonding improvement with minimal additional cost, avoiding the excessive application of strengthening materials across all areas.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The surface treatment layer provides buffering capability to enhance package reliability under thermal shock, while reducing production costs by minimizing the application area compared to full-surface strengthening layers.

Implementation Method 1

under the thermal expansion and contraction of the manufacturing process

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

enhance package reliability under thermal shock

Methodology Applied

Scientific EffectThermal shock: Thermal Shock

Implementation Method 3

a bonding layer disposed on the functional pad and the surface treatment layer; an electronic element disposed on the bonding layer and being bonded onto the functional pad and the surface treatment layer via the bonding layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20230187402A1Electronic package and manufacturing method thereof

Publication Date: 2023.06.15 PHOENIX PIONEER TECH

AI summary

An electronic package is provided, in which a surface treatment layer is formed on parts of a surface of a functional pad, such that an electronic element is in contact with and bonded to the functional pad and the surface treatment layer via a bonding layer. Therefore, when the electronic package undergoes thermal shock, the surface treatment layer having buffering capability can improve packaging reliability of the electronic package.