Patterned Thin Film Capacitors for Substrate Power Management
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Solution Overview
Problem
Legacy land-side capacitors (LSCs) face limitations in reduced size systems due to space constraints and distance from the die attached on the front side of substrates, hindering effective power management in mobile electronic devices.
Innovation Solution
The use of patterned thin film capacitors (TFCs) sheets, where metal layers separated by a dielectric layer are applied to substrates with holes drilled and plated with copper to create capacitors, allowing for discreet and efficient power management by transforming TFC sheets into discrete capacitors at specific substrate locations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If land-side capacitors are attached to the back side of substrates, then power management is provided, but space constraints and distance from the die limit effectiveness in reduced size systems
Solution Approach 1:
The patent transitions capacitor placement from the traditional back-side (2D plane) to the front-side of the substrate, utilizing the vertical dimension and available front-side space. This dimensional change allows capacitors to be positioned closer to the die, improving power management effectiveness while maintaining reduced system size.
Solution Approach 2:
The capacitor structures are integrated into the substrate fabrication process itself, with capacitor layers formed during substrate manufacturing rather than as post-processing attachments. This preliminary integration ensures optimal positioning and reduces the number of manufacturing steps required.
2Reliability
If TFC sheets are patterned to create discrete capacitors at specific substrate locations, then space limitations are overcome and power management is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into the TFC sheet structure: the sheet provides both the capacitor dielectric layer and the substrate interface layer. Patterned regions of the TFC sheet create discrete capacitors while non-patterned regions provide routing features, merging capacitor formation and interconnect functionality into a single component.
Solution Approach 2:
The TFC sheet serves multiple purposes: it acts as the dielectric for capacitors, provides the interface between the capacitor and substrate, and when patterned, creates both capacitor structures and routing features. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power management by utilizing patterned TFCs to provide capacitors and routing features within package assemblies, overcoming space limitations and distance constraints, thus enhancing power management in reduced size systems.
Implementation Method 1
a dielectric layer; wherein the first side and the second side of the TFC sheet are metal layers separated by a dielectric layer
Implementation Method 2
holes, such as laser-drilled VIAs, may be drilled through the patterned TFC sheet, for example where the metal first side of the TFC sheet proximate to the drilled holes is removed, into the substrate exposing a metal pad in the substrate. The drilled holes may subsequently be plated with copper (Cu)
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.