Patterning Semiconductor Oxides on Non-Planar Surfaces via Elastomeric Stamping
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Solution Overview
Problem
Existing methods for patterning semiconductor oxides, such as indium tin oxide, on non-planar surfaces are limited due to material brittleness and adhesion issues, leading to low yield and poor performance, especially when attempting to form devices with two-dimensional curvature.
Innovation Solution
A method involving a strike layer and patterned second layer applied via stamping, where the second layer protects the first layer during a subtractive process, allowing for the patterning of semiconductor oxides on both planar and non-planar substrates, including those with two-dimensional curvature, using an elastomeric stamp at controlled temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is deformed into a desired configuration after material deposition, then arbitrary-shaped devices can be formed, but the substrate and/or any layers deposited on the substrate may be damaged or destroyed
Solution Approach 1:
The substrate is deformed into the desired non-planar configuration before material deposition occurs. This preliminary deformation allows the substrate to be in its final shape when materials are deposited, eliminating the need for post-deposition deformation that would damage the substrate or deposited layers. The elastomeric stamp is also pre-deformed to match the substrate geometry before application.
Solution Approach 2:
The substrate material properties are changed by selecting materials that can withstand the required deformation. The patent uses flexible substrates and elastomeric stamps with appropriate mechanical properties that allow deformation to the desired configuration while maintaining structural integrity during and after the deposition process.
2Ease of manufacture
If conventional patterning methods are used on non-planar substrates, then standard fabrication processes can be applied, but the material brittleness and adhesion issues lead to low yield and poor performance
Solution Approach 1:
An elastomeric stamp is introduced as an intermediary tool to transfer the pattern onto the non-planar substrate. The stamp acts as a mediator that can conform to the substrate's three-dimensional geometry, allowing standard patterning techniques to be adapted for complex surfaces without directly exposing the brittle semiconductor oxide layers to mechanical stress during patterning.
Solution Approach 2:
The pattern is first created on a planar elastomeric stamp, which is then deformed and applied to the non-planar substrate. This copying approach allows the pattern to be transferred without directly manipulating the fragile deposited layers on the complex geometry substrate, thereby improving yield while maintaining ease of manufacture.
3Adaptability or versatility
If photolithography is used to pattern transparent conductive oxides on non-planar surfaces, then conventional patterning techniques can be employed, but the process becomes complex and less effective for three-dimensional geometries
Solution Approach 1:
The complex multi-step photolithography process is replaced with a simpler mechanical stamping process. Instead of using photoresist coatings, exposure, development, and etching steps, the pattern is directly transferred mechanically through the elastomeric stamp, significantly reducing process complexity while maintaining adaptability to non-planar surfaces.
Solution Approach 2:
Instead of applying patterned photoresist onto the non-planar substrate and then performing etching, the invention inverts the approach by first creating the pattern on a stamp and then transferring it directly to the substrate. This reversal eliminates the need for photoresist and complex chemical processing steps on the three-dimensional geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the successful patterning of transparent conductive oxides on non-planar surfaces with increased responsivity, as demonstrated by passive matrix organic photodetector focal plane arrays on flat and hemispherical surfaces, improving device performance and adaptability to complex geometries.
Implementation Method 1
A patterned second layer is applied over the first layer via stamping
Implementation Method 2
using an elastomeric stamp at controlled temperatures
Implementation Method 3
The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer
Data Source
AI summary
A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.