Patterning Slit Sheet for Large OLED Thin Film Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thin film deposition methods face challenges in producing large-sized organic light-emitting display devices with high light-emission efficiency, as they struggle to form fine patterns on large substrates due to the need for large, complex fine metal masks that are difficult to manufacture and align accurately, leading to issues with driving voltage, current density, brightness, color purity, and lifespan characteristics.
Innovation Solution
A thin film deposition apparatus with a patterning slit sheet that includes multiple sub-slits, allowing for the overlap of patterns formed by each sub-slit to create a desired pattern, which is smaller than the substrate and can be moved relative to it, preventing shadow zones and defects while improving manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional thin film deposition apparatus uses a large fine metal mask to form patterns on large substrates, then the substrate coverage is improved, but the device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent divides the large substrate into multiple regions and uses multiple deposition sources arranged in an array. Each deposition source deposits material onto a specific region through a simple slit structure, eliminating the need for a single large complex mask. The segmented approach allows each component to remain simple while collectively covering the entire large substrate area.
Solution Approach 2:
The patent introduces a slit structure as an intermediary element between the deposition source and substrate. This slit acts as a simple pattern-defining element that replaces the complex fine metal mask. The slit is much simpler to manufacture and align than a full FMM, while still achieving the desired pattern formation through its geometric configuration.
2Manufacturing precision
If a fine metal mask is used to form fine patterns, then the pattern precision is improved, but the alignment accuracy and manufacturing yield decrease due to difficulty in manufacturing and aligning large masks
Solution Approach 1:
By segmenting the deposition process into multiple independent sources, each handling a portion of the pattern, the system eliminates the need for a single large mask that is difficult to align. Each deposition source with its slit is smaller and easier to align accurately, improving overall reliability while maintaining pattern precision through the coordinated action of multiple sources.
Solution Approach 2:
The patent uses multiple identical or similar deposition sources arranged in an array, each performing the same deposition function. This replication of simple units replaces the single complex mask system, making the system more reliable and easier to manufacture while achieving the same pattern precision through geometric arrangement rather than complex mask features.
3Device complexity
If a single deposition source is used, then the device simplicity is improved, but the productivity and deposition efficiency decrease when forming patterns on large substrates
Solution Approach 1:
The patent merges multiple simple deposition sources into a coordinated array system. Each source remains simple in structure, but their combined operation enables simultaneous deposition across the entire large substrate area, dramatically improving productivity and deposition efficiency compared to a single source that would need to scan or sequentially process the substrate.
Solution Approach 2:
The patent creates a dynamic deposition system where multiple sources work in coordination, potentially with independent control. This dynamic arrangement allows the system to adapt to different substrate sizes and pattern requirements while maintaining the simplicity of individual sources, achieving high productivity without sacrificing device simplicity at the component level.
4Reliability
If intermediate layers are added to improve light-emission efficiency, then the emission performance is improved, but the number of deposition steps and manufacturing complexity increase
Solution Approach 1:
The patent applies the same segmented deposition approach to forming intermediate layers. Multiple deposition sources can deposit different intermediate layer materials simultaneously or sequentially onto different regions, reducing the overall manufacturing complexity compared to using a single source that would require multiple separate deposition cycles for each layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the efficient deposition of thin films on large substrates with improved light-emission efficiency and manufacturing yield, allowing for the production of high-quality large-sized organic light-emitting display devices by simplifying the deposition process and reducing the need for complex masks.
Implementation Method 1
a deposition source that discharges a deposition material
Data Source
AI summary
A method of forming a thin film on a substrate includes arranging the substrate to face a thin film deposition apparatus; and discharging a deposition material via a deposition source of the thin film deposition apparatus onto the substrate; wherein a deposition source nozzle unit of the thin film deposition apparatus is disposed at a side of the deposition source and includes a plurality of deposition source nozzles arranged in a first direction; wherein a patterning slit sheet of the thin film deposition apparatus is disposed to be between the deposition source nozzle unit and the substrate, the patterning slit sheet including a plurality of patterning slits, and wherein each of the patterning slits includes a plurality of sub-slits.