Payload Interposer Board for CubeSat Bus Integration

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Solution Overview

Problem

Conventional CubeSats face challenges in providing a multi-mission bus capability due to limited power and volume, complex payload interfaces, and high costs, leading to poor reliability and longer development times, making it difficult to extend their design to larger form factors.

Innovation Solution

A payload interposer (PIP) board provides a standard interface for hosting payloads on a space vehicle platform, abstracting the space vehicle's hardware from the payload developer, enabling rapid integration and customization through a microcontroller and field programmable gate array (FPGA) for power management, communication, and command implementation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional CubeSats are used for multi-mission capability, then cost is reduced and development time is shortened, but reliability deteriorates and performance is limited due to poor interfaces and complex constraints

Engineering Contradiction:
ImprovecostVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a standardized payload interface as an intermediary layer between the CubeSat bus and the payload. This interface includes standardized mechanical mounting, electrical connectors, and communication protocols that mediate between the constrained CubeSat platform and diverse payload requirements, improving reliability without increasing cost

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a universal payload interface that can accommodate multiple different payload types on the same CubeSat bus. The standardized interface allows a single CubeSat platform to serve multiple missions by simply changing payloads, achieving multi-functionality without increasing manufacturing cost

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional satellite busses are used with detailed payload interfaces, then reliability is improved and performance is optimized, but cost increases to tens or hundreds of millions of dollars and development time extends

Engineering Contradiction:
ImprovereliabilityVSAvoidcost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the satellite system into a standardized bus platform and interchangeable payload modules. The bus provides core functions (power, attitude control, communication) while payloads provide mission-specific functionality. This segmentation allows reliable core functions to be reused across missions while keeping individual payloads simple and cost-effective

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent establishes standardized interfaces and protocols in advance during bus design, including pre-defined electrical connectors, power distribution schemes, and communication protocols. This preliminary action eliminates the need for custom interface design for each mission, reducing cost and development time while maintaining reliability through proven standards

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If CubeSats are designed with limited power and volume, then cost is reduced and launch availability is improved, but payload performance is constrained and development complexity increases

Engineering Contradiction:
ImprovecostVSAvoiddesign complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent changes key design parameters by establishing standardized interface specifications including electrical connection schemes, power distribution voltages, and mechanical mounting dimensions. These parameter standardizations simplify the design process for both bus and payload developers, reducing complexity while maintaining cost-effectiveness

Inventive Principle:
Principle #35Parameter changes

4Reliability

If custom payload interfaces are designed for each mission, then performance is optimized and reliability is improved, but development time increases and costs rise

Engineering Contradiction:
ImprovereliabilityVSAvoiddevelopment time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent creates a universal payload interface that works with multiple different payload types through standardized mechanical, electrical, and software interfaces. This universality allows the same bus platform to reliably support diverse missions without requiring custom interface design for each, reducing development time while maintaining reliability through consistent standards

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11142346B1Space vehicle system and payload interposer (PIP) board
Publication Date: 2021.10.12 TRIAD NATIONAL SECURITY LLC
  • US11142346B1 patent drawing
  • US11142346B1 patent drawing
  • US11142346B1 patent drawing

AI summary

A payload interposer (PIP) board provides an interface for hosting payloads on a space vehicle platform. Payload development may be performed via the PIP board in a manner that “abstracts” the hardware of the space vehicle from the payload developer. The PIP board may include a host side payload interface connector that connects to a space vehicle and a payload side payload interface connector that connects to a payload. Power, CDH, and other space vehicle functionality may thus be provided to the payload from the space vehicle via the PIP board.