PCB Adhesion Holes for Moisture-Resistant Battery Pack Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing battery packs face issues with moisture and debris entering through slots, causing short circuits and damage to electronic components on the printed circuit board, as low-pressure molded material fails to reliably adhere to exposed edges or flat surfaces.
Innovation Solution
The use of adhesion holes with diameters ranging from 0.5 mm to 2 mm, positioned around components on the printed circuit board, allows low-pressure molded material to flow through and wrap around the board, enhancing adhesion and preventing moisture and debris infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If low pressure molded material is applied to encapsulate the printed circuit board, then components are protected from moisture and debris, but the material fails to adhere reliably to exposed edges or flat surfaces
Solution Approach 1:
The printed circuit board is designed with an array of holes that allow the low pressure molded material to flow through and penetrate into the board structure. This creates mechanical interlocking and significantly improves adhesion between the encapsulant and the PCB, preventing delamination while maintaining protective encapsulation.
Solution Approach 2:
The invention transitions from surface-level adhesion to three-dimensional penetration by incorporating holes through the PCB. The encapsulant material flows through these holes, creating anchoring points throughout the board thickness, which transforms the adhesion mechanism from two-dimensional surface bonding to three-dimensional structural integration.
2Object-affected harmful factors
If the printed circuit board is completely encapsulated with low pressure molded material, then components are fully protected, but moisture or debris may seep in between the material and the board causing damage
Solution Approach 1:
The array of holes in the PCB creates a porous structure that allows the encapsulant material to penetrate deeply into the board. This penetration eliminates voids and gaps between the encapsulant and PCB, creating a seamless barrier that prevents moisture and debris infiltration while maintaining complete component protection.
3Reliability
If adhesion holes are created in the printed circuit board, then material adhesion is improved, but the board structure is modified
Solution Approach 1:
The holes are strategically positioned in specific regions of the PCB where they will effectively enhance adhesion without compromising overall board integrity. The local modification of creating holes only in necessary areas maintains the global structural properties of the PCB while achieving improved encapsulant adhesion in critical zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents moisture and debris from penetrating between the low-pressure molded material and the printed circuit board, protecting encapsulated components by improving the adhesion of the material to the board, thus preventing damage to sensitive electronic components.
Implementation Method 1
the low pressure molded material has flowed through the plurality of adhesion holes
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present disclosure is directed to a battery pack comprising a housing, a plurality of battery cells, a battery cell holder holding the plurality of battery cells, a printed circuit board, a plurality of components requiring exposure, the plurality of components affixed to the printed circuit board, a plurality of adhesion holes positioned to form a boundary about the plurality of components, a low pressure molded material applied to the printed circuit board such that the plurality of components are exposed and surrounded by the low pressure molded material.