Embedded PCB Adhesive Removal for Circuit Reliability
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Solution Overview
Problem
Existing methods for manufacturing embedded printed circuit boards (PCBs) face reliability issues due to adhesive components remaining on the surface of electronic devices, which can separate from the circuit patterns and affect device performance.
Innovation Solution
A method involving the application of an adhesive on a support board, attaching an electronic device, forming insulation layers, and creating via connections, followed by the removal of the release film and adhesive paste, ensuring the adhesive material does not remain between internal circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding sheet with adhesive is used to mount the electronic device, then the electronic device can be securely attached to the PCB, but adhesive components remain on the electronic device surface and may separate from circuit patterns, reducing reliability
Solution Approach 1:
The adhesive layer is completely removed from the electronic device surface after bonding, extracting the harmful adhesive residue that causes separation from circuit patterns. The bonding sheet is peeled off to remove the adhesive, eliminating the source of reliability problems while maintaining the attachment strength benefit during the bonding process.
Solution Approach 2:
The bonding sheet with adhesive is applied temporarily during the manufacturing process to securely attach the electronic device, then removed after the device is firmly bonded to the PCB substrate. This preliminary bonding action allows for secure attachment during assembly while enabling complete removal of adhesive residues afterward.
2Reliability
If the adhesive layer is removed after bonding, then adhesive residues that affect device characteristics are eliminated, but the process complexity increases
Solution Approach 1:
The bonding sheet is designed as a disposable temporary tool that serves its bonding function and is then completely discarded. This eliminates the need for complex adhesive removal processes while ensuring no adhesive residues remain on the device, as the entire bonding sheet including adhesive is peeled off and discarded.
3Reliability
If the bonding sheet is peeled off to remove adhesive, then adhesive residues are eliminated, but the circuit pattern may be stripped along with the bonding sheet
Solution Approach 1:
The electronic device is firmly bonded to the PCB substrate through the adhesive layer before the bonding sheet is peeled off. This preliminary bonding creates a strong attachment that prevents the circuit pattern from being stripped when the bonding sheet is removed, as the device itself anchors the circuit pattern to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach secures device reliability by preventing adhesive material from interfering with internal circuit patterns and ensuring they are not stripped during the process, thus enhancing the reliability of the embedded PCBs.
Implementation Method 1
applying an adhesive on a support board; attaching an electronic device on the adhesive
Data Source
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AI summary
Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.