PCB Adhesive Segmentation for Display Panel Bonding
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Solution Overview
Problem
In the manufacturing of display apparatuses, by-products protruding outside the adhesive layer can cause post-process defects and appearance defects when attaching a printed circuit board to a display panel.
Innovation Solution
A method of manufacturing a display apparatus involves providing a display panel with a metal plate under one area, attaching a printed circuit board to another area with a preliminary adhesive layer and release film, forming the adhesive layer by removing the release film, and bending the panel to attach the printed circuit board under the metal plate, thereby removing any by-products outside the adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a preliminary adhesive layer is applied to the entire printed circuit board for bonding, then the bonding area is increased and attachment strength is improved, but by-products protruding outside the adhesive layer are generated causing post-process defects and appearance defects
Solution Approach 1:
The adhesive layer is segmented into a first adhesive layer for bonding the printed circuit board to the display panel, and a second adhesive layer for bonding the printed circuit board to the metal plate. This segmentation allows each adhesive layer to be optimized for its specific function, preventing by-products from protruding outside the bonding area while maintaining sufficient bonding strength.
Solution Approach 2:
Different regions of the printed circuit board are assigned different adhesive layers with different properties. The first adhesive layer is applied only in the region bonding to the display panel, while the second adhesive layer is applied in the region bonding to the metal plate. This local quality approach ensures adhesive is present only where needed, eliminating by-products in non-bonding areas.
2Manufacturing precision
If the adhesive layer is formed to cover the entire printed circuit board surface, then bonding coverage is maximized, but by-products protruding outside the adhesive layer cause post-process and appearance defects
Solution Approach 1:
The adhesive application is segmented into two distinct zones: a first adhesive layer bonded to the display panel area and a second adhesive layer bonded to the metal plate area. This segmentation achieves precise bonding coverage in each region without excessive adhesive extending beyond bonding boundaries, thereby preventing by-product formation.
Solution Approach 2:
The adhesive layers are preliminarily applied to specific regions of the printed circuit board before final assembly. The first adhesive layer is applied to the display panel bonding region, and the second adhesive layer is applied to the metal plate bonding region, ensuring adhesive is positioned exactly where needed before components are brought together.
3Reliability
If adhesive is applied extensively to ensure complete coverage during bonding, then bonding reliability is improved, but by-products protruding outside the adhesive layer generate post-process defects
Solution Approach 1:
The bonding process is segmented into two distinct bonding operations: first bonding the printed circuit board to the display panel using the first adhesive layer, then bonding the printed circuit board to the metal plate using the second adhesive layer. This segmentation ensures each bonding operation uses adhesive only where needed, maintaining reliability while preventing by-products.
Solution Approach 2:
The printed circuit board acts as an intermediary component with two separately applied adhesive layers, each serving as a mediator between the printed circuit board and its respective bonding partner (display panel or metal plate). This intermediary approach allows precise control of adhesive placement and bonding conditions for each interface independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the probability of defects in the manufacturing process by ensuring that by-products are removed from the adhesive layer, thereby improving the manufacturing efficiency and quality of the display apparatus.
Implementation Method 1
the release film adhesive layer is attached to the second portion, and removing the release film from the printed circuit board includes removing the preliminary printed circuit board adhesive layer by the release film adhesive layer
Implementation Method 2
bending the panel bending area, and attaching the printed circuit board under the metal plate
Data Source
AI summary
A method of manufacturing a display apparatus includes: providing a display panel including a first panel area, a second panel area, and a panel bending area between the first panel area and the second panel area; providing a printed circuit board (PCB) to which a preliminary PCB adhesive layer and a release film are attached; bonding the PCB to the second panel area; and forming a PCB adhesive layer by removing the release film from the PCB. In the providing of the PCB, the release film is attached to the PCB through a release film adhesive layer between the release film and the PCB, the preliminary PCB adhesive layer includes a first portion and a second portion other than the first portion, the first portion corresponds to the PCB adhesive layer, and the release film adhesive layer is attached to the second portion.