Multi-layer PCB Air Quality Sensor Thermal Isolation
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Solution Overview
Problem
Existing air-quality detection apparatuses face challenges in maintaining accuracy due to heat generated by heat-generating sensors affecting temperature/humidity sensors, and they are not portable due to a non-compact design, requiring a solution that optimizes sensor arrangement and heat management within a single casing.
Innovation Solution
The air-quality detection apparatus employs a multi-layered structure of printed circuit boards (PCBs) within a casing, where heat-generating sensors are positioned above the temperature/humidity sensor, using the PCBs to prevent heat transfer and incorporating a vent hole system for air flow that also serves as a passage for external air, eliminating the need for separate heat insulation materials and additional vent holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heat-generating sensors and temperature/humidity sensors are disposed in a compact structure within a single casing, then the device achieves portability and compactness, but the heat generated by heat-generating sensors affects the accuracy of temperature/humidity detection
Solution Approach 1:
The device is segmented into multiple functional layers: a first PCB layer for heat-generating sensors (dust sensor, CO sensor) and a second PCB layer for temperature/humidity sensors. This spatial segmentation isolates heat sources from sensitive temperature measurement components, preventing thermal interference while maintaining compact form factor.
Solution Approach 2:
The patent transitions from planar sensor arrangement to three-dimensional multi-layer PCB stacking. By utilizing the vertical dimension with multiple PCB layers separated by insulating structures, the design achieves both compact footprint and thermal isolation, resolving the contradiction between small size and measurement accuracy.
2Measurement precision
If separate heat insulation materials or heat blocking materials are used to prevent heat transfer, then temperature/humidity sensor accuracy is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The support rib structure serves dual functions: mechanically supporting the first PCB and simultaneously acting as a heat blocking barrier between the heat-generating dust sensor and the temperature/humidity sensor. This merging of structural and thermal management functions eliminates the need for separate heat insulation materials.
Solution Approach 2:
The insulating structure integrated into the support rib performs multiple roles: mechanical support for the PCB, thermal insulation barrier, and structural spacer. This multi-functionality reduces component count and assembly complexity while maintaining sensor accuracy.
3Measurement precision
If separate vent holes are formed for temperature/humidity detection, then air flow for accurate sensing is improved, but device complexity and aesthetic appearance deteriorate
Solution Approach 1:
The vent holes in the cover are designed to serve multiple purposes: providing air flow paths for both the dust sensor and the temperature/humidity sensor, and maintaining aesthetic appearance by minimizing the number of holes. This multi-functional design eliminates the need for separate dedicated vent holes for each sensor type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of temperature/humidity sensing by minimizing heat interference and allows for a compact, portable design with improved aesthetic appeal, while enabling convenient assembly and maintenance, and facilitates IoT-enabled air quality data transmission over communication networks.
Implementation Method 1
a first printed circuit board (PCB) and a second PCB mounted in a casing body... using the PCBs to prevent heat transfer
Implementation Method 2
incorporating a vent hole system for air flow that also serves as a passage for external air
Data Source
AI summary
An air-quality detection apparatus is disclosed. The air-quality detection apparatus includes a casing body including a bottom and a side wall extending upwards from the circumference of the bottom, a first printed circuit board (PCB) disposed horizontally above the bottom, a temperature/humidity sensor mounted on the bottom surface of the first PCB, a second PCB disposed horizontally above the first PCB, and a CO2 sensor mounted on the second PCB.